Abstract: A heat-resistant housing (G) for electrical function elements (EB) having a receiving chamber (AK) lying as centrally as possible inside it, a cover block (AD), which is sealed with the receiving chamber (AK), and a receiving block (AB), which is inserted into the receiving chamber and encloses the electrical function elements with a material having a temperature-dependent specific thermal capacity, preferably a high-polymer thermoplastic having low density. In the event of a cyclic interplay of heating and cooling phases, a lower stationery temperature results in the receiving block in the proposed structure in comparison to conventional structures, while the overall weight and volume are nonetheless lower. This is achieved by the high-polymer thermoplastic in the receiving block, which increasingly melts as the temperature rises. The large thermal capacity resulting therefrom acts like a heat sink.