Abstract: A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches in the thermal coefficients of thermal expansion of the die, the conductive metal bond layer and the substrate. An additional coating of conductive metal may be flowed over the bond lines to reinforce the bonds.

Abstract: An antimicrobial coating fabrication method includes providing a substrate having a substrate surface, providing at least one first antimicrobial material in at least one first pattern on the substrate surface and providing at least one second antimicrobial material on the substrate surface in at least one second pattern disposed in generally adjacent relationship with respect to the at least one first pattern of the first antimicrobial material. An antimicrobial structure is also disclosed.

Abstract: A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches in the thermal coefficients of thermal expansion of the die, the conductive metal bond layer and the substrate. An additional coating of conductive metal may be flowed over the bond lines to reinforce the bonds.

Abstract: An in-space spacecraft servicing system (10) includes a servicing spacecraft (22) and a propellant module (24). The servicing spacecraft includes a client servicing system (136), as well as navigation avionics (108) for independent flight operation and a servicing propellant tank (170). The propellant module moves the servicing module from an upper stage drop off location and releases it in proximity to a client spacecraft (16) for a servicing mission. It has a propellant tank (172) with capacity for multiple missions and is used to refill the servicing spacecraft's propellant tanks between missions. Either or both the servicing spacecraft and the propellant module may have navigation avionics. The servicing spacecraft also has a universal docking adaptor (70) for different client spacecraft, and can convert a client spacecraft from non-cooperative to cooperative.

Abstract: An in-space spacecraft servicing system (10) includes a servicing spacecraft (22) and a propellant module (24). The servicing spacecraft includes a client servicing system (136), as well as navigation avionics (108) for independent flight operation and a servicing propellant tank (170). The propellant module moves the servicing module from an upper stage drop off location and releases it in proximity to a client spacecraft (16) for a servicing mission. It has a propellant tank (172) with capacity for multiple missions and is used to refill the servicing spacecraft's propellant tanks between missions. Either or both the servicing spacecraft and the propellant module may have navigation avionics. The servicing spacecraft also has a universal docking adaptor (70) for different client spacecraft, and can convert a client spacecraft from non-cooperative to cooperative.