Patents by Inventor Lepeng LIU

Lepeng LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411574
    Abstract: The present application relates to a substrate, an LED light source assembly and manufacturing methods therefor. The substrate includes a first substrate and a second substrate which are arranged in a stacked manner. Electrode soldering regions on the front side of the first substrate and corresponding first conductive regions on the back side of the first substrate are electrically connected; and second conductive regions on the front side of the second substrate and corresponding third conductive regions on the back side of the second substrate are electrically connected, where the corresponding first conductive regions and the corresponding second conductive regions are electrically connected.
    Type: Application
    Filed: September 18, 2021
    Publication date: December 21, 2023
    Applicant: Shenzhen Jufei Optoelectronics Co., Ltd.
    Inventors: Yongheng HU, Mingquan LI, Ruibing CHEN, Yanming CHEN, Gang WEN, Wendou XIANG, Wenqin XU, Meng XIE, Pingru SUN, Yunhua LI, Meizheng XING, Siqing GAO, Jintao CAO, Haizhi LIANG, Lepeng LIU