Patents by Inventor Leping Bu

Leping Bu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Biocompatible Packaging Suitable for Long-term Implantation and Method of Formation
    Publication number: 20130316180
    Abstract: A method for forming an electrical-conductor-free vapor barrier suitable for protecting long-term implanted electronic systems is disclosed. The method comprises forming a nascent layer of a partially cured layer and repeatedly compressing the layer via a roller-based process. Once the layer has been suitably compressed, the layer is fully cured. In some embodiments, a multi-layer protective layer is formed by repeating the roller-based formation process for each of a plurality of layers. In some embodiments, a multi-layer protective layer comprising layers of different materials is formed.
    Type: Application
    Filed: May 7, 2013
    Publication date: November 28, 2013
    Applicant: Case Western Reserve University
    Inventors: Wen H. Ko, Shem Lachman, Christian A. Zorman, Leping Bu