Patents by Inventor Leping Wei

Leping Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240030279
    Abstract: The present disclosure provides a semiconductor structure and a method for forming the semiconductor structure. The method includes: providing a substrate including a device region and a guard ring region surrounding the device region; and forming a power device in the device region and forming a guard ring in the guard ring region, wherein the guard ring is doped with a first dopant ion that is formed by a partial doping process used in a formation of the power device, and a conductivity type of the first dopant ion in the guard ring is different from a device type of the power device. Since the guard ring is formed by the necessary doping process used in forming the power device, additional photomask process and doping process for forming the guard ring is omitted, effectively reducing process steps and process costs.
    Type: Application
    Filed: April 24, 2023
    Publication date: January 25, 2024
    Inventors: Zhengrong CHEN, Wensheng Qian, Sitong Chen, Zhaozhao Xu, Wan Song, Donghua Liu, Leping Wei