Abstract: Exemplary methods of semiconductor processing may include forming a layer of silicon-containing material on a semiconductor substrate. The methods may include performing a post-formation treatment on the layer of silicon-containing material to yield a treated layer of silicon-containing material. The methods may include contacting the treated layer of silicon-containing material with an adhesion agent. The methods may include forming a layer of a resist material on the treated layer of silicon-containing material.

Abstract: Gene detecting methods without using PCR are disclosed. The methods comprise forming sandwich complexes by target genes with nano-probes and capture probes, wherein nano-probes are modified with recognition molecules and magnetic microparticles modified with capture molecules; then separating the sandwich complexes; releasing the nano-probes; and detecting molecular ion peaks of encoding molecules on the surface of nano-probes by mass spectrometric detection directly, characterized in that the proportions of recognition molecules and encoding molecules on the nano-probes are 300-2000:1.

Abstract: Gene detecting methods without using PCR are disclosed. The methods comprise forming sandwich complexes by target genes with nano-probes and capture probes, wherein nano-probes are modified with recognition molecules and magnetic microparticles modified with capture molecules; then separating the sandwich complexes; releasing the nano-probes; and detecting molecular ion peaks of encoding molecules on the surface of nano-probes by mass spectrometric detection directly, characterized in that the proportions of recognition molecules and encoding molecules on the nano-probes are 300-2000:1.