Abstract: A method is provided for in situ functionality testing of electrical switches using a Functional Reflectometry Test (FRT) of switches on the signal path of electrical circuits in a semiconductor interface. The method includes initiating the functionality testing of the electrical switches in situ, wherein the functionality of the electrical switches is tested while the electrical switches are connected to the Automatic Test Equipment (ATE) and are in-use testing semiconductors. The method also includes conducting full Functional Reflectometry Testing of the electrical switches in situ in an open switch state and a closed switch state to determine whether each of the electrical switches is one of fully functional, stuck closed, and stuck open, wherein testing for each state is performed as a single vector functional test to minimize test time overhead.

Abstract: A method for compliance testing of a Digital Interface Board attached to Automatic Test Equipment in the testing of integrated circuit semiconductor devices using Impedance Response Profiling. The includes launching alternating voltage digital clock signals from the Pin Electronics to one or more circuit paths in the Digital Interface Board, and sampling a mix of the launched alternating voltage digital clock signals and reflected signals. The method also includes compositing time domain waveforms originating at the Pin Electronics, and generating an initial reflection response profile baseline. The method is repeated at a later predetermined time, generating a later reflection response profile. The method further includes comparing the initial reflection response profile baseline with the later reflection response profile, and determining whether the one or more circuit paths of the Digital Interface Board are in compliance with predetermined operating standards.

Abstract: A method is provided for in situ functionality testing of electrical switches using a Functional Reflectometry Test (FRT) of switches on the signal path of electrical circuits in a semiconductor interface. The method includes initiating the functionality testing of the electrical switches in situ, wherein the functionality of the electrical switches is tested while the electrical switches are connected to the Automatic Test Equipment (ATE) and are in-use testing semiconductors. The method also includes conducting full Functional Reflectometry Testing of the electrical switches in situ in an open switch state and a closed switch state to determine whether each of the electrical switches is one of fully functional, stuck closed, and stuck open, wherein testing for each state is performed as a single vector functional test to minimize test time overhead.

Abstract: A method is provided for testing the functionality of a device under test interface circuitry located between automated testing equipment (ATE) and a device under test (DUT). The method includes disconnecting the device under test from the device under test interface circuitry, utilizing a Source Measurement Unit (SMU) that generates and measures voltage and current and uses force and sense lines, and testing a switch located in the device under test interface circuitry using a two-state alarm process. The method also includes applying a voltage using the a voltage source measurement device in a first state in which force and sense lines of the voltage source measurement device are connected in the device under test interface circuitry. The method further includes detecting whether an alarm signal due to an open circuit has been activated, and determining that the switch being tested in the device under test interface circuitry is operating properly by the absence of the alarm signal being activated.

Abstract: A method and system are provided for optimizing operational throughput for a semiconductor device handler having multiple stages. The method includes receiving semiconductor devices for testing at an input carrier buffer, and operating the handler in the testing of semiconductor devices. The method also includes recording operational throughput characteristics for each operational stage of the handler, and analyzing recorded operational throughput characteristics for each operational stage of the handler. Additionally, the method includes determining which operational stage of the handler has the most limiting constraint causing a lowest operational drumbeat, and adjusting operational parameters of the operational stage of the handler that has the lowest operational drumbeat to increase the operational drumbeat.

Abstract: A method and system are provided for optimizing operational throughput for a semiconductor device handler having multiple stages. The method includes receiving semiconductor devices for testing at an input carrier buffer, and operating the handler in the testing of semiconductor devices. The method also includes recording operational throughput characteristics for each operational stage of the handler, and analyzing recorded operational throughput characteristics for each operational stage of the handler. Additionally, the method includes determining which operational stage of the handler has the most limiting constraint causing a lowest operational drumbeat, and adjusting operational parameters of the operational stage of the handler that has the lowest operational drumbeat to increase the operational drumbeat.