Patents by Inventor Les Ticey

Les Ticey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor component
    Patent number: 5900669
    Abstract: A substrate having a vent (20) and a method of forming the vent (20). A substrate (11) has conductive traces (14) and a semiconductor chip attach pad (17) on a top surface and conductive traces (12) and a bonding pad (13) on the bottom surface. A masking layer (18) is formed over the substrate (11) and openings are formed in the masking layer (18) to expose the conductive traces (14) and a semiconductor chip attach pad (17). The vent (20) is formed in the masking layer (18). A semiconductor chip (31) is mounted to the semiconductor chip attach pad (17). During a step of encapsulating the semiconductor chip (31) with a mold compound, the vent (20) provides pressure relief.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: May 4, 1999
    Assignee: Motorola, Inc.
    Inventors: James H. Knapp, Keith E. Nelson, Les Ticey, Kevin J. Foley