Patents by Inventor Lesli A. Derryberry

Lesli A. Derryberry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally efficient power device package
    Patent number: 4907067
    Abstract: A hermetic semiconductor device package is disclosed which is capable of handling high power devices in an electrically and thermally efficient manner. The package includes a dielectric substrate with cutouts for die mount and/or bonding to a plurality of thermally and electrically conductive plates which are electrically isolated from each other.
    Type: Grant
    Filed: May 11, 1988
    Date of Patent: March 6, 1990
    Assignee: Texas Instruments Incorporated
    Inventor: Lesli A. Derryberry
  • A chip carrier and mounting structure connected to the chip carrier
    Patent number: 4890194
    Abstract: A chip carrier including a connecting strip is supported by a thermally conductive spacer block under its center, which provides a mechanical connection to a circuit board. The external contact pads on the underside of the chip carrier are not bonded directly to traces on the board, but instead are bonded to the connecting strip which is formed from a polymer layer having conductive traces thereon. The conductive traces may be bonded to traces on the circuit board.
    Type: Grant
    Filed: February 28, 1987
    Date of Patent: December 26, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: Lesli A. Derryberry, Charles E. Williams
  • Contact joint for semiconductor chip carriers
    Patent number: 4862247
    Abstract: A chip carrier (34) having a peripheral edge (40), a bottom surface (42) and an inwardly directed arcuate connecting surface (44) is provided. The chip carrier (34) is connected to a printed wiring board (36) by solder (38). The solder (38) adheres to the metallized portion (46) on the chip carrier (34) and the metallized portion (48) on the printed wiring board (36). The connecting surface (44) allows stress to be more evenly distributed to reduce the occurrence of the cracks in the solder (38) which cause failure of the circuit.
    Type: Grant
    Filed: January 26, 1989
    Date of Patent: August 29, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: Lesli Derryberry, Tom Petrovich
  • Circuit board with a chip carrier and mounting structure connected to the chip carrier
    Patent number: 4750089
    Abstract: A chip carrier is supported by a thermally conductive spacer block under its center, which provides mechanical connection to the circuit board. The external contact pads on the underside of the chip carrier are not bonded directly to the traces on the board, but instead are bonded to a connecting strip, i.e. a polymer layer having conductive traces thereon, and the traces on the connecting strip are bonded to traces on the board.
    Type: Grant
    Filed: November 22, 1985
    Date of Patent: June 7, 1988
    Assignee: Texas Instruments Incorporated
    Inventors: Lesli A. Derryberry, Charles E. Williams