Patents by Inventor Leslie Cox Barber
Leslie Cox Barber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8227395Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.Type: GrantFiled: July 29, 2010Date of Patent: July 24, 2012Assignee: Air Products and Chemicals, Inc.Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Jr., Leslie Cox Barber
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Patent number: 8007986Abstract: Suitable additives that may be added into immersion fluids, immersion fluids comprising at least one carrier medium selected from an aqueous fluid, a non-aqueous fluid, and mixtures thereof, and immersions fluids comprising at least one carrier medium and at least one additive useful for performing immersion lithography at an operating wavelength ranging from 140 nm to 365 nm are disclosed herein.Type: GrantFiled: May 29, 2007Date of Patent: August 30, 2011Assignee: Air Products and Chemicals, Inc.Inventors: Peng Zhang, Bridgette Maria Budhlall, Gene Everad Parris, Leslie Cox Barber
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Publication number: 20110171583Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width roughness when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of defects such as pattern collapse and/or line width roughness on a plurality of photoresist coated substrates employing the process solution of the present invention.Type: ApplicationFiled: December 2, 2010Publication date: July 14, 2011Applicant: Air Products and Chemicals, Inc.Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, JR., Leslie Cox Barber
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Patent number: 7879531Abstract: Suitable additives that may be added into immersion fluids, immersion fluids comprising at least one carrier medium selected from an aqueous fluid, a non-aqueous fluid, and mixtures thereof, and immersions fluids comprising at least one carrier medium and at least one additive useful for performing immersion lithography at an operating wavelength ranging from 140 nm to 365 nm are disclosed herein.Type: GrantFiled: January 7, 2005Date of Patent: February 1, 2011Assignee: Air Products and Chemicals, Inc.Inventors: Peng Zhang, Bridgette Maria Budhlall, Gene Everad Parris, Leslie Cox Barber
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Publication number: 20100304313Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.Type: ApplicationFiled: July 29, 2010Publication date: December 2, 2010Applicant: AIR PRODUCTS AND CHEMICALS, INC.Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, JR., Leslie Cox Barber
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Patent number: 7591270Abstract: Process solutions comprising one or more surfactants are used to reduce the number of pattern collapse defects on a plurality of photoresist coated substrates during the manufacture of semiconductor devices.Type: GrantFiled: September 14, 2006Date of Patent: September 22, 2009Assignee: Air Products and Chemicals, Inc.Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Jr., Leslie Cox Barber
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Patent number: 7521405Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width roughness when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of defects such as pattern collapse and/or line width roughness on a plurality of photoresist coated substrates employing the process solution of the present invention.Type: GrantFiled: March 19, 2004Date of Patent: April 21, 2009Assignee: Air Products and Chemicals, Inc.Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Jr., Leslie Cox Barber
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Patent number: 7348300Abstract: Disclosed herein are process solutions, which may be aqueous-based, non-aqueous-based, and combinations thereof, that contain at least one alkoxylated acetylenic diol surfactant. In one aspect, the process solution comprises water and an alkoxylated acetylenic diol surfactant having the formula A: where r and t are 1 or 2, (n+m) is 1 to 30 and (p+q) is 1 to 30.Type: GrantFiled: February 1, 2005Date of Patent: March 25, 2008Assignee: Air Products and Chemicals, Inc.Inventors: Kevin Rodney Lassila, Paula Ann Uhrin, Peng Zhang, Danielle Megan King Curzi, Leslie Cox Barber, Brenda Faye Ross
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Patent number: 7129199Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.Type: GrantFiled: July 10, 2003Date of Patent: October 31, 2006Assignee: Air Products and Chemicals, Inc.Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Jr., Leslie Cox Barber
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Publication number: 20040204328Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width roughness when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of defects such as pattern collapse and/or line width roughness on a plurality of photoresist coated substrates employing the process solution of the present invention.Type: ApplicationFiled: March 19, 2004Publication date: October 14, 2004Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Leslie Cox Barber
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Publication number: 20040053800Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.Type: ApplicationFiled: July 10, 2003Publication date: March 18, 2004Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Leslie Cox Barber
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Publication number: 20040053172Abstract: Process solutions comprising one or more acetylenic diol type surfactants are used to improve the wettability of a substrate surface by lowering the contact angle of the aqueous developer solution are enclosed herein. In one embodiment, the process solution is used to prepare the surface of the substrate prior to the development of the resist coating layer.Type: ApplicationFiled: August 4, 2003Publication date: March 18, 2004Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Leslie Cox Barber
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Publication number: 20040029396Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.Type: ApplicationFiled: January 9, 2003Publication date: February 12, 2004Inventors: Peng Zhang, Danielle Megan King Curzi, Eugene Joseph Karwacki, Leslie Cox Barber
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Publication number: 20040029395Abstract: Process solutions comprising one or more acetylenic diol type surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects by improving the wetting of the solution on the surface of the patterned photoresist layer while minimizing foaming and bubble generation.Type: ApplicationFiled: August 12, 2002Publication date: February 12, 2004Inventors: Peng Zhang, Danielle Megan King, Eugene Joseph Karwacki, Leslie Cox Barber
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Patent number: 6641986Abstract: Aqueous solutions comprising one or more acetylenic diol type surfactants are used to improve the wettability of a substrate surface by lowering the contact angle of the aqueous developer solution are enclosed herein. In one embodiment, the aqueous solution is used to prepare the surface of the substrate prior to development of the resist coating layer.Type: GrantFiled: August 12, 2002Date of Patent: November 4, 2003Assignee: Air Products and Chemicals, Inc.Inventors: Peng Zhang, Danielle Megan King, Eugene Joseph Karwacki, Leslie Cox Barber