Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.

Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.

Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.

Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.

Abstract: One example includes a conductive leadframe configured to couple to an integrated circuit (IC) chip die on a contact surface of the IC chip die. The conductive leadframe includes a plurality of chip-pin connections configured to facilitate conductive coupling to bond pads of the IC chip die via conductive lead wires. The conductive leadframe also includes a support beam that extends across the conductive leadframe along the contact surface of the IC chip die to enable support of the IC chip die to the conductive leadframe at a plurality of support locations during testing of the IC associated with the IC chip die.

Abstract: The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow process—a result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.

Abstract: The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow process—a result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.

Abstract: The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow process—a result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.

Abstract: A system for positioning a carrier relative to a travel path which includes a base having a pair of opposing side walls extending normal to the base and defining a path therebetween. A force applying device is disposed in one of the side walls and extends into the path for applying a force in the direction of the other side wall. A pair of rotatable eccentric members is secured to the other of the walls and extends into the path for selectively positioning a carrier between the eccentric members and the force applying device.

Abstract: A system for applying a rotary force to strips of varying widths. The system includes a plurality of adjacent tracks of progressively greater width, each of the tracks disposed at a height above all tracks of lesser width. A plurality of rotating members are provided, one rotating member extending into one of the tracks and extending to the surface of the associated track. An adjustable drive disc is adjusted to be disposed over a preselected one of the rotating members and is movable toward the rotating members to apply a rotary force to a strip disposed between the rotating member and the disc. Each of the tracks is defined by a pair of spaced apart surfaces with all of the rotating members being on a common rotating shaft.

Abstract: In integrated semiconductor manufacturing, semiconductor dies may be packaged in ceramic packages. Such packages typically have a base into which the semiconductor die is securedly placed and typically have a lead frame securedly attached to base so that electrical connection may be made to the semiconductor die. A halagen lamp radiant chamber significantly reduces the time it takes to attach the die and lead frame to the ceramic base while reducing particles commonly associated with open belt converyor furnaces.

Abstract: A method of curing a die attach material for a semiconductor device which includes providing a carrier containing a plurality of stacked leadframe strips, each leadframe strip with a die attach material thereon. One leadframe strip is ejected from the carrier, travels into a chamber and is centered therein. The leadframe strip is then heated and the die attach material is cured selective to the leadframe strip using a tungsten-halogen lamp. Simultaneously volatile products of the cure are exhausted from the chamber. The leadframe strip is then returned to its original position in the carrier, the carrier is elevated so that a different leadframe strip is in position for ejection from the carrier and is ejected.

Abstract: A method and system for curing a die attach material for attachment of a semiconductor die to a leadframe which includes a carrier receiving location for receiving at least one carrier(1) wherein each carrier contains at least one leadframe strip (3) therein, a die attach material (15) on the leadframe strip and a semiconductor die (13) on the die attach material. A heat source (5) is provided for radiating thermal energy to the carrier receiving location. A reflector (9) is disposed around the heat source and the carrier receiving location for reflecting thermal energy from the heat source to the carrier receiving location. A source of flowing cool gas (11) is provided in heat exchange relationship with the reflector for cooling the reflector while heating the gas. The heated gas is passed through the carrier receiving location to provide a source of heat by convection at the carrier receiving location and purge the carrier receiving location of volatiles.

Abstract: The invention is to a method for forming solder contact balls for a ball grid array semiconductor package by aligning a sheet of solder (18) on a semiconductor package substrate (15) having a plurality of contact areas (16). A heated wire grid (20,21)is applied to the sheet of solder (18) to separate the solder sheet into a plurality of individual solder plates (22), one each for each contact area (16). Heat is then applied to the solder plates (22) and substrate (15) to melt the solder plates (22) and to reflow the melted solder to form a solder ball (23) at each contact area (16).

Abstract: In semiconductor device assembly operations, the use of an optical heat source 28, such as a tungsten halogen lamp module, is to replace ovens and heater blocks for curing die-attach material and molding compound with reduction in cycle time, cost, footprint, and contamination.

Abstract: Semiconductor die attach occurs by bonding the semiconductor die to a support member such as a lead frame. An optical heat source provides heat for bonding the die attach material. An exhaust system removes vapors from the die attach material during bonding. A tungsten halogen lamp is an exemplary optical heat source. An air amplifier is exemplary to provide exhaust pressure. An exhaust manifold having a plurality of screens spreads the exhaust pressure over the width of the lead frame. A gas shower disposed over the lead frame aids in removing vapors.