Patents by Inventor Leslie M. Charns

Leslie M. Charns has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad having polishing surface with continuous protrusions
    Patent number: 10293459
    Abstract: Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: May 21, 2019
    Assignee: Cabot Microelectronics Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
    Patent number: 10160092
    Abstract: Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 25, 2018
    Assignee: Cabot Microelectronics Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
    Publication number: 20170203409
    Abstract: Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
    Type: Application
    Filed: April 5, 2017
    Publication date: July 20, 2017
    Inventors: Paul Andre LEFEVRE, William C. ALLISON, Alexander William SIMPSON, Diane SCOTT, Ping HUANG, Leslie M. CHARNS, James Richard RINEHART, Robert KERPRICH
  • Polishing pad having polishing surface with continuous protrusions
    Patent number: 9649742
    Abstract: Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: May 16, 2017
    Assignee: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
    Patent number: 9597769
    Abstract: Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: March 21, 2017
    Assignee: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, James P. LaCasse, Diane Scott, Alexander William Simpson, Ping Huang, Leslie M. Charns
  • POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS HAVING TAPERED SIDEWALLS
    Publication number: 20140273777
    Abstract: Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
    Publication number: 20140206268
    Abstract: Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 24, 2014
    Applicant: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Rinehart, Robert Kerprich
  • POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER
    Publication number: 20130324020
    Abstract: Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.
    Type: Application
    Filed: June 4, 2012
    Publication date: December 5, 2013
    Inventors: Paul Andre Lefevre, William C. Allison, James P. LaCasse, Diane Scott, Alexander William Simpson, Ping Huang, Leslie M. Charns