Patents by Inventor Leslie M. Landsberger
Leslie M. Landsberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8969203Abstract: There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist.Type: GrantFiled: April 21, 2011Date of Patent: March 3, 2015Assignee: Sensortechnics GmbHInventors: Leslie M. Landsberger, Oleg Grudin, Jens Urban, Uwe Schwarz
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Patent number: 8907718Abstract: There is described a passive heater-and-diode multiplexing network for selective addressing of thermally-coupled and electrically-disconnected fuses within a passive device network (resistor/capacitor/inductor) or within an application circuit.Type: GrantFiled: March 4, 2010Date of Patent: December 9, 2014Assignee: Sensortechnics GmbHInventors: Saed Salman, Oleg Grudin, Leslie M. Landsberger, Gennadiy Frolov, Tommy Tsang, Zhen-grong Huang
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Patent number: 8847117Abstract: There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical component.Type: GrantFiled: March 16, 2009Date of Patent: September 30, 2014Assignee: Sensortechnics GmbHInventors: Oleg Grudin, Yougui Liao, Leslie M. Landsberger, Gennadiy Frolov, Lyudmila Grudina, Gerald Arzoumanian, Saed Salman, Tommy Tsang, Bowei Zhang
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Patent number: 8677818Abstract: There is described a flow sensing device having a semiconductor chip with a flow channel integrated therein and a sensing element positioned in the flow channel, and a package base attached to the semiconductor chip and allowing access to the two passage-openings of the flow channel from opposite sides of the package base.Type: GrantFiled: March 10, 2010Date of Patent: March 25, 2014Assignee: Sensortechnics GmbHInventors: Leslie M. Landsberger, Oleg Grudin, Salman Saed, Gennadiy Frolov
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Publication number: 20120176180Abstract: There is described a passive heater-and-diode multiplexing network for selective addressing of thermally-coupled and electrically-disconnected fuses within a passive device network (resistor/capacitor/inductor) or within an application circuit.Type: ApplicationFiled: March 4, 2010Publication date: July 12, 2012Inventors: Salman Saed, Oleg Grudin, Leslie M. Landsberger, Gennadiy Frolov, Tommy Tsang, Zhen-grong Huang
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Publication number: 20120161256Abstract: There is described a flow sensing device having a semiconductor chip with a flow channel integrated therein and a sensing element positioned in the flow channel, and a package base attached to the semiconductor chip and allowing access to the two passage-openings of the flow channel from opposite sides of the package base.Type: ApplicationFiled: March 10, 2010Publication date: June 28, 2012Inventors: Oleg Grudin, Gennadiy Frolov, Leslie M. Landsberger, Saed Salman
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Patent number: 8149081Abstract: A method for post-thermal-trimming annealing a thermally-trimmable resistor thermally-isolated on a substrate, the method comprising: trimming said thermally-trimmable resistor by applying a first power-measured signal to a heating resistor; and applying a second power-measured signal corresponding to a desired average annealing temperature to said heating resistor, wherein said second power-measured signal has a lower power level than said first power-measured signal.Type: GrantFiled: May 2, 2011Date of Patent: April 3, 2012Assignee: Sensortechnics GmbHInventors: Leslie M. Landsberger, Oleg Grudin, Gennadiy Frolov
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Patent number: 8111128Abstract: A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.Type: GrantFiled: February 6, 2008Date of Patent: February 7, 2012Assignee: Sensortechnics GmbHInventors: Oleg Grudin, Salman Saed, Tommy Tsang, Bowei Zhang, Leslie M. Landsberger, L. Richard Williston
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Publication number: 20120017424Abstract: A method for post-thermal-trimming annealing a thermally-trimmable resistor thermally-isolated on a substrate, the method comprising: trimming said thermally-trimmable resistor by applying a first power-measured signal to a heating resistor; and applying a second power-measured signal corresponding to a desired average annealing temperature to said heating resistor, wherein said second power-measured signal has a lower power level than said first power-measured signal.Type: ApplicationFiled: May 2, 2011Publication date: January 26, 2012Applicant: MICROBRIDGE TECHNOLOGIES INC.Inventors: Leslie M. LANDSBERGER, Oleg GRUDIN, Gennadiy FROLOV
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Publication number: 20110314435Abstract: There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist.Type: ApplicationFiled: April 21, 2011Publication date: December 22, 2011Inventors: Leslie M. LANDSBERGER, Oleg GRUDIN, Jens URBAN, Uwe SCHWARZ
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Patent number: 8022717Abstract: There is described a method to change the value of a thermally-trimmable resistor in a non-permanent way by raising the temperature of the thermally-trimmable resistor to a level that is somewhere between room temperature and trimming temperature. By doing this, the trimming range that is available via true thermal trimming may be explored without actually trimming the value of the resistor. This is possible when the thermally-trimmable resistor, or a portion thereof, has an essentially non-zero temperature coefficient of resistance (TCR).Type: GrantFiled: March 16, 2007Date of Patent: September 20, 2011Assignee: Sensortechnics GmbHInventors: Oleg Grudin, Leslie M. Landsberger, Gennadiy Frolov
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Publication number: 20110220631Abstract: There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical componentType: ApplicationFiled: March 16, 2009Publication date: September 15, 2011Inventors: Oleg Grudin, Yougui Liao, Leslie M. Landsberger, Gennadiy Frolov, Lyudmila Grudina, Gerald Arzoumanian, Saed Salman, Tommy Tsang, Bowei Zhang
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Patent number: 7956717Abstract: A circuit for trimming a thermally-trimmable resistor, measuring a temperature coefficient of resistance of the thermally-trimmable resistor, and annealing a thermally-trimmable resistor post-trimming, the circuit comprising: a thermally-isolated area on a substrate housing the thermally-trimmable resistor; heating circuitry for applying a signal to a heating resistor; and a constant-power module adapted to maintain power dissipated in the heating resistor substantially constant over a duration of the signal by varying at least one parameter of the signal as a result of a change in resistance of the heating resistor during the signal.Type: GrantFiled: January 30, 2007Date of Patent: June 7, 2011Assignee: Microbridge Technologies Inc.Inventors: Leslie M. Landsberger, Oleg Grudin, Gennadiy Frolov
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Patent number: 7951721Abstract: There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist.Type: GrantFiled: November 10, 2005Date of Patent: May 31, 2011Inventors: Leslie M. Landsberger, Oleg Grudin, Jens Urban, Uwe Schwarz
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Patent number: 7714694Abstract: A compound resistor is used to compensate for trimming induced shift in temperature coefficient of resistance of a trimmable resistor. The compound resistor is composed of a first and second portion, at least one of the two portions being thermally trimmable, and the parameters for the first and second portion are selected such that the trimming induced shift can be minimized on an overall resistance and temperature coefficient of resistance of the compound resistors by trimming the trimmable resistor. The invention also allows for exploring trimming range available via true thermal trimming without actually trimming out resistor's value of a resistor. The invention also allows design of thermal isolation to minimize or optimize resistance variation of the overall compound resistance.Type: GrantFiled: March 21, 2007Date of Patent: May 11, 2010Assignee: Microbridge Technologies Canada, Inc.Inventors: Leslie M. Landsberger, Oleg Grudin
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Publication number: 20100101077Abstract: There are described various methods and circuits for trimming the parameter value of a thermally mutable electrical component in two directions. A sequence of heat pulses is selected as a function of thermal history using an adaptive trimming algorithm, where parameters of the sequence of heat pulses are based on a resulting impact of previous heating pulses. Direction of trimming, trimming increment, and remaining trimming distance can all be used to determine the parameters of succeeding heat pulses, wherein the parameters of the pulses can be, for example, amplitude, duration, and time interval between pulses.Type: ApplicationFiled: January 6, 2010Publication date: April 29, 2010Applicant: MICROBRIDGE TECHNOLOGIES INC.Inventors: Oleg Grudin, Leslie M. Landsberger, Gennadiy Frolov, Lyudmila Grudina
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Patent number: 7703051Abstract: There is described methods and circuits for trimming a temperature coefficient of change of a parameter of at least one electrical component while maintaining a substantially constant parameter value, the method comprising applying a heating cycle to trim said parameter value away from a target parameter value and back to said target parameter value, whereby the temperature coefficient of change is modified after applying said heating cycle.Type: GrantFiled: March 19, 2004Date of Patent: April 20, 2010Assignee: Microbridge Technologies Inc.Inventors: Oleg Grudin, Leslie M. Landsberger, Gennadiy Frolov, Lyudmila Grudina
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Publication number: 20100073121Abstract: A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.Type: ApplicationFiled: February 6, 2008Publication date: March 25, 2010Applicant: MICROBRIDGE TECHNOLOGIES INC.Inventors: Oleg Grudin, Salman Saed, Tommy Tsang, Bowei Zhang, Leslie M. Landsberger, L. Richard Williston
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Patent number: 7667156Abstract: There are described various methods and circuits for trimming the parameter value of a thermally mutable electrical component in two directions. A sequence of heat pulses is selected as a function of thermal history using an adaptive trimming algorithm, where parameters of the sequence of heat pulses are based on a resulting impact of previous heating pulses. Direction of trimming, trimming increment, and remaining trimming distance can all be used to determine the parameters of succeeding heat pulses, wherein the parameters of the pulses can be, for example, amplitude, duration, and time interval between pulses.Type: GrantFiled: September 20, 2005Date of Patent: February 23, 2010Assignee: Microbridge Technologies Inc.Inventors: Oleg Grudin, Leslie M. Landsberger, Gennadiy Frolov, Lyudmila Grudina
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Publication number: 20090322356Abstract: There is described a method to change the value of a thermally-trimmable resistor in a non-permanent way by raising the temperature of the thermally-trimmable resistor to a level that is somewhere between room temperature and trimming temperature. By doing this, the trimming range that is available via true thermal trimming may be explored without actually trimming the value of the resistor. This is possible when the thermal Iy-trimmable resistor, or a portion thereof, has an essentially non-zero temperature coefficient of resistance (TCR).Type: ApplicationFiled: March 16, 2007Publication date: December 31, 2009Inventors: Oleg Grudin, Leslie M. Landsberger, Gennadiy Frolov