Abstract: A packaging and cooling assembly for integrated circuit chips includes a base for reception of one or more circuit chips, and a combination heat sink and cover for attachment to the base. The circuit chips are mounted circuit side down on the base, and include flexible lead frames for attachment to bonding pads on the base. Compliant cushions that generally conform to the shape and size of the chips are held loosely between the circuit sides of the chips, and the base. The heat sink enages the back sides of the circuit chips when it is attached to the base. This causes the chips to compress the compliant cushions, thereby holding the chips firmly in position, and forming a high thermal conductivity interface between the chips and the heat sink. To further enhance the heat transfer characteristics of the interface, a thin film of fluid is coated on the back sides of each chip to fill in the microvoids which result from asperity contact of the heat sink and chip mating surfaces.

Abstract: An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

Abstract: An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on the opposite faces of the interposer engage the contacts on said chip and substrate, respectively. A thermal transfer member contacts the opposite face of the chip and is engaged to the substrate so as to compress the interposer thereby simultaneously establishing relatively low inductance electrical connections between the chip contacts and the substrate contacts and good thermal contact between the chip and the thermal transfer member. The assembly is particularly adapted to provide power to the chip of a TAB-type integrated circuit assembly which includes a flexible lead frame connected between the chip and the substrate.

Abstract: An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser cap facing the component is a condenser surface and is provided with a number of parallel fluted sections. Each fluted section has parallel vertical sidewalls and a semi-circular top section. A multi-layered fiberous, porous, wick is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves exposed to the wick. The pipe chamber is filled with a two-phase working fluid. The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface.