Patents by Inventor Leslie S. Polaski

Leslie S. Polaski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5604333
    Abstract: The formation of solder bridges between pads on circuit boards is minimized by a process and structure for wicking excess solder deposited during a wave soldering process. Solder thieves are placed adjacent to a last pad of a series of pads and are approximately the same width and twice the length as the pad in order to provide sufficient wicking of solder. Thus, the excess solder is formed on the solder thieves and solder bridges are prevented.
    Type: Grant
    Filed: November 30, 1994
    Date of Patent: February 18, 1997
    Assignee: Intel Corporation
    Inventors: Richard A. Kennish, Leslie S. Polaski