Patents by Inventor Leslie S. Weinman

Leslie S. Weinman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma polymerized ethane for interlayer dielectric
    Patent number: 4374179
    Abstract: A plasma polymerized ethane thin film deposited on a variety of substrates has been discovered to be an improved interlayer dielectric. It is a material having property of high dielectric strength and unique low dielectric constant. It also has advantages of depositing pinhole free, crack resistant with good step coverage and low deposition cost.
    Type: Grant
    Filed: December 18, 1980
    Date of Patent: February 15, 1983
    Assignee: Honeywell Inc.
    Inventors: Jacob W. Lin, Leslie S. Weinman