Patents by Inventor Lester D. Bennington
Lester D. Bennington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7837824Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.Type: GrantFiled: January 18, 2006Date of Patent: November 23, 2010Assignee: Henkel CorporationInventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Douglas N. Horner
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Patent number: 7482391Abstract: Room-temperature vulcanized (RTV) foaming compositions are disclosed. The compositions include at least one enoxysilyl functional group and/or at least one alkoxysilyl functional group, at least one amine catalyst, and at least one silicon hydride functional group. Also disclosed are methods of preparing such compositions and methods of using such compositions, methods for making a gasket, and articles of manufacture.Type: GrantFiled: May 9, 2005Date of Patent: January 27, 2009Assignee: Henkel CorporationInventors: Robert Cross, Lester D. Bennington, Bahram Issari, John Kerr
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Publication number: 20080105374Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.Type: ApplicationFiled: January 18, 2006Publication date: May 8, 2008Applicant: HENKEL CORPORATIONInventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Matthias E. Liistro, Douglas N. Horner
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Patent number: 6884314Abstract: The present invention relates generally to conductive, silicone-based compositions, with improved initial adhesion and reduced micro-voiding. More specifically, the present invention relates to a conductive, silicone-based composition, which includes a polyorganosiloxane, a silicone resin, and a conductive filler component.Type: GrantFiled: April 23, 2001Date of Patent: April 26, 2005Assignee: Henkel CorporationInventors: Robert P. Cross, Lester D. Bennington
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Patent number: 6838182Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.Type: GrantFiled: January 14, 2003Date of Patent: January 4, 2005Assignee: Henkel CorporationInventors: Philip L. Kropp, Lester D. Bennington, Robert P. Cross, Bahram Issari
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Publication number: 20040116547Abstract: The present invention relates to dual curing silicone compositions which are capable of crosslinking when subjected to actinic radiation and/or heat. The compositions contain a reactive organopolysiloxane having a function group selected from the group consisting of (meth)acrylate, carboxylate, maleate, cinnamate and combinations thereof; a silicon hydride crosslinker; an organo-metallic hydrosilation catalyst; and a photoinitiator. These compositions can be cured to relatively thick films using UV light due to the presence of the specific olefinic unsaturated groups, and can also be partially or fully cured at room temperature or under thermal exposure. These compositions are particularly useful as conformal coatings, and in particular as coatings in electronic applications.Type: ApplicationFiled: September 30, 2003Publication date: June 17, 2004Applicant: LOCTITE CORPORATIONInventor: Lester D. Bennington
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Publication number: 20030164223Abstract: The present invention relates generally to conductive, silicone-based compositions, with improved initial adhesion and reduced micro-voiding. More specifically, the present invention relates to a conductive, silicone-based composition, which includes a polyorganosiloxane, a silicone resin, and a conductive filler component.Type: ApplicationFiled: October 23, 2002Publication date: September 4, 2003Inventors: Robert P. Cross, Lester D. Bennington
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Publication number: 20030138647Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.Type: ApplicationFiled: January 14, 2003Publication date: July 24, 2003Applicant: Loctite CorporationInventors: Philip L. Kropp, Lester D. Bennington, Robert P. Cross, Bahram Issari
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Patent number: 6573328Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.Type: GrantFiled: January 3, 2001Date of Patent: June 3, 2003Assignee: Loctite CorporationInventors: Philip L. Kropp, Lester D. Bennington, Robert P. Cross, Bahram Issari
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Publication number: 20020142174Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.Type: ApplicationFiled: January 3, 2001Publication date: October 3, 2002Inventors: Philip L. Kropp, Lester D. Bennington, Robert P. Cross, Bahram Issari
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Patent number: 6444740Abstract: The present invention provides silicone compositions, cured elastomers thereof demtonstrate improved resistance to oil. The compositions include a reactive silicone component, wherein the silicone component cures by way of an addition cure mechanism or a condensation cure mechanism; and a basic filler component to confer oil resistance to the cured elastomer. Where the reactive silicone component cures by way of an addition cure mechanism, an addition cure catalyst is also included. To that end, in one embodiment of the invention, the composition includes a vinyl-terminated silicone fluid, a hydrogen-functionalized silicone fluid; a basic filler to confer oil resistance to the cured elastomer and an addition cure catalyst. In another embodiment of the invention, the composition includes a hydroxy-terminated diorganopolysiloxane, a precipitated calcium carbonate, at least about 5% by weight of a composition comprising magnesium oxide particles having a mean particle size of about 0.5 &mgr;M to about 1.Type: GrantFiled: September 27, 2001Date of Patent: September 3, 2002Assignee: Loctite CorporationInventors: Alfred A. DeCato, Lester D. Bennington
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Patent number: 6391993Abstract: The present invention provides anaerobic adhesive compositions, reaction products of which demonstrate controlled-strength at ambient temperature conditions and enhanced resistance to thermal degradation at elevated temperature conditions. The compositions are (meth)acrylate- and/or polyorganosiloxane-based and may include one or more of a variety of other components, such as certain coreactants, a maleimide component, a diluent component reactive at elevated temperature conditions, mono- or poly-hydroxyalkane components, and other components.Type: GrantFiled: February 1, 2000Date of Patent: May 21, 2002Assignee: Loctite CorporationInventors: Shabbir Attarwala, Gina M. Mazzella, Hsien-Kun Chu, Dzu D. Luong, Lester D. Bennington, Mark M. Konarski, Eerik Maandi, Richard D. Rich, Natalie R. Li, Frederick F. Newberth, III, Susan L. Levandoski
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Patent number: 6323253Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation, and optionally through exposure to moisture as well. The cured products demonstrate high resistance to flammability and combustibility. The flame-retardant components is a combination of hydrated alumina and an organo ligand complex of a transition metal or an organosiloxane ligand complex of a transition metal or a combination thereof.Type: GrantFiled: September 9, 1999Date of Patent: November 27, 2001Assignee: Loctite CorporationInventor: Lester D. Bennington
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Patent number: 6284817Abstract: The invention provides a conductive, resin-based composition, which includes a resinous material, and a conductive filler dispersed therein. The conductive filler includes a first conductive filler component and a second conductive filler component. The particles of the first conductive filler component are harder than those of the second conductive filler component, when measured using the Mohs hardness scale. The composition is subjected to shear mixing forces which shearingly disperse the first and second conductive filler components throughout the resinous material in such a way that the particles of the second conductive filler component occupy the interstitial voids within the network of first conductive filler component particles contained in the resinous material and thereby enhance conductivity.Type: GrantFiled: February 29, 2000Date of Patent: September 4, 2001Assignee: Loctite CorporationInventors: Robert Parkins Cross, I. David Crossan, Lester D. Bennington
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Patent number: 6281261Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation. The cured products demonstrate high resistance to flammability and combustibility.Type: GrantFiled: November 20, 2000Date of Patent: August 28, 2001Assignee: Loctite CorporationInventor: Lester D. Bennington
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Patent number: 5516812Abstract: A radiation and moisture curable silicone conformal coating composition comprises a silicone fluid of a monovalent ethylenically unsaturated functional group endcapped silicone and at least one (meth)acryl-functionalized silicone; and a photoinitiator effective for radiation curing of the silicone composition. The encapped silicone is the product of a reaction between a silanol terminated silicone and a silane cross linker having joined directly to a silicon atom thereof a monovalent ethylenically unsaturated functional group and at least 2 hydrolyzable groups.Type: GrantFiled: August 1, 1994Date of Patent: May 14, 1996Assignee: Loctite CorporationInventors: Hsien K. Chu, Robert P. Cross, Lester D. Bennington
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Patent number: 4526955Abstract: Radiation polymerizable compositions containing organopolysiloxanes having an average of at least one nitrogen-containing group per molecule linked to a silicon atom through an Si--N or Si--O--N linkage and a photo-induced free radical source.Type: GrantFiled: January 3, 1984Date of Patent: July 2, 1985Assignee: SWS Silicones CorporationInventors: Lester D. Bennington, Richard C. McAfee