Patents by Inventor Lester D. Bennington

Lester D. Bennington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7837824
    Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: November 23, 2010
    Assignee: Henkel Corporation
    Inventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Douglas N. Horner
  • Patent number: 7482391
    Abstract: Room-temperature vulcanized (RTV) foaming compositions are disclosed. The compositions include at least one enoxysilyl functional group and/or at least one alkoxysilyl functional group, at least one amine catalyst, and at least one silicon hydride functional group. Also disclosed are methods of preparing such compositions and methods of using such compositions, methods for making a gasket, and articles of manufacture.
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: January 27, 2009
    Assignee: Henkel Corporation
    Inventors: Robert Cross, Lester D. Bennington, Bahram Issari, John Kerr
  • Publication number: 20080105374
    Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.
    Type: Application
    Filed: January 18, 2006
    Publication date: May 8, 2008
    Applicant: HENKEL CORPORATION
    Inventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Matthias E. Liistro, Douglas N. Horner
  • Patent number: 6884314
    Abstract: The present invention relates generally to conductive, silicone-based compositions, with improved initial adhesion and reduced micro-voiding. More specifically, the present invention relates to a conductive, silicone-based composition, which includes a polyorganosiloxane, a silicone resin, and a conductive filler component.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: April 26, 2005
    Assignee: Henkel Corporation
    Inventors: Robert P. Cross, Lester D. Bennington
  • Patent number: 6838182
    Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: January 4, 2005
    Assignee: Henkel Corporation
    Inventors: Philip L. Kropp, Lester D. Bennington, Robert P. Cross, Bahram Issari
  • Publication number: 20040116547
    Abstract: The present invention relates to dual curing silicone compositions which are capable of crosslinking when subjected to actinic radiation and/or heat. The compositions contain a reactive organopolysiloxane having a function group selected from the group consisting of (meth)acrylate, carboxylate, maleate, cinnamate and combinations thereof; a silicon hydride crosslinker; an organo-metallic hydrosilation catalyst; and a photoinitiator. These compositions can be cured to relatively thick films using UV light due to the presence of the specific olefinic unsaturated groups, and can also be partially or fully cured at room temperature or under thermal exposure. These compositions are particularly useful as conformal coatings, and in particular as coatings in electronic applications.
    Type: Application
    Filed: September 30, 2003
    Publication date: June 17, 2004
    Applicant: LOCTITE CORPORATION
    Inventor: Lester D. Bennington
  • Publication number: 20030164223
    Abstract: The present invention relates generally to conductive, silicone-based compositions, with improved initial adhesion and reduced micro-voiding. More specifically, the present invention relates to a conductive, silicone-based composition, which includes a polyorganosiloxane, a silicone resin, and a conductive filler component.
    Type: Application
    Filed: October 23, 2002
    Publication date: September 4, 2003
    Inventors: Robert P. Cross, Lester D. Bennington
  • Publication number: 20030138647
    Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.
    Type: Application
    Filed: January 14, 2003
    Publication date: July 24, 2003
    Applicant: Loctite Corporation
    Inventors: Philip L. Kropp, Lester D. Bennington, Robert P. Cross, Bahram Issari
  • Patent number: 6573328
    Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: June 3, 2003
    Assignee: Loctite Corporation
    Inventors: Philip L. Kropp, Lester D. Bennington, Robert P. Cross, Bahram Issari
  • Publication number: 20020142174
    Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.
    Type: Application
    Filed: January 3, 2001
    Publication date: October 3, 2002
    Inventors: Philip L. Kropp, Lester D. Bennington, Robert P. Cross, Bahram Issari
  • Patent number: 6444740
    Abstract: The present invention provides silicone compositions, cured elastomers thereof demtonstrate improved resistance to oil. The compositions include a reactive silicone component, wherein the silicone component cures by way of an addition cure mechanism or a condensation cure mechanism; and a basic filler component to confer oil resistance to the cured elastomer. Where the reactive silicone component cures by way of an addition cure mechanism, an addition cure catalyst is also included. To that end, in one embodiment of the invention, the composition includes a vinyl-terminated silicone fluid, a hydrogen-functionalized silicone fluid; a basic filler to confer oil resistance to the cured elastomer and an addition cure catalyst. In another embodiment of the invention, the composition includes a hydroxy-terminated diorganopolysiloxane, a precipitated calcium carbonate, at least about 5% by weight of a composition comprising magnesium oxide particles having a mean particle size of about 0.5 &mgr;M to about 1.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: September 3, 2002
    Assignee: Loctite Corporation
    Inventors: Alfred A. DeCato, Lester D. Bennington
  • Patent number: 6391993
    Abstract: The present invention provides anaerobic adhesive compositions, reaction products of which demonstrate controlled-strength at ambient temperature conditions and enhanced resistance to thermal degradation at elevated temperature conditions. The compositions are (meth)acrylate- and/or polyorganosiloxane-based and may include one or more of a variety of other components, such as certain coreactants, a maleimide component, a diluent component reactive at elevated temperature conditions, mono- or poly-hydroxyalkane components, and other components.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: May 21, 2002
    Assignee: Loctite Corporation
    Inventors: Shabbir Attarwala, Gina M. Mazzella, Hsien-Kun Chu, Dzu D. Luong, Lester D. Bennington, Mark M. Konarski, Eerik Maandi, Richard D. Rich, Natalie R. Li, Frederick F. Newberth, III, Susan L. Levandoski
  • Patent number: 6323253
    Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation, and optionally through exposure to moisture as well. The cured products demonstrate high resistance to flammability and combustibility. The flame-retardant components is a combination of hydrated alumina and an organo ligand complex of a transition metal or an organosiloxane ligand complex of a transition metal or a combination thereof.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: November 27, 2001
    Assignee: Loctite Corporation
    Inventor: Lester D. Bennington
  • Patent number: 6284817
    Abstract: The invention provides a conductive, resin-based composition, which includes a resinous material, and a conductive filler dispersed therein. The conductive filler includes a first conductive filler component and a second conductive filler component. The particles of the first conductive filler component are harder than those of the second conductive filler component, when measured using the Mohs hardness scale. The composition is subjected to shear mixing forces which shearingly disperse the first and second conductive filler components throughout the resinous material in such a way that the particles of the second conductive filler component occupy the interstitial voids within the network of first conductive filler component particles contained in the resinous material and thereby enhance conductivity.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: September 4, 2001
    Assignee: Loctite Corporation
    Inventors: Robert Parkins Cross, I. David Crossan, Lester D. Bennington
  • Patent number: 6281261
    Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation. The cured products demonstrate high resistance to flammability and combustibility.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: August 28, 2001
    Assignee: Loctite Corporation
    Inventor: Lester D. Bennington
  • Patent number: 5516812
    Abstract: A radiation and moisture curable silicone conformal coating composition comprises a silicone fluid of a monovalent ethylenically unsaturated functional group endcapped silicone and at least one (meth)acryl-functionalized silicone; and a photoinitiator effective for radiation curing of the silicone composition. The encapped silicone is the product of a reaction between a silanol terminated silicone and a silane cross linker having joined directly to a silicon atom thereof a monovalent ethylenically unsaturated functional group and at least 2 hydrolyzable groups.
    Type: Grant
    Filed: August 1, 1994
    Date of Patent: May 14, 1996
    Assignee: Loctite Corporation
    Inventors: Hsien K. Chu, Robert P. Cross, Lester D. Bennington
  • Patent number: 4526955
    Abstract: Radiation polymerizable compositions containing organopolysiloxanes having an average of at least one nitrogen-containing group per molecule linked to a silicon atom through an Si--N or Si--O--N linkage and a photo-induced free radical source.
    Type: Grant
    Filed: January 3, 1984
    Date of Patent: July 2, 1985
    Assignee: SWS Silicones Corporation
    Inventors: Lester D. Bennington, Richard C. McAfee