Abstract: Technologies for radiofrequency optimized interconnects for a quantum processor are disclosed. In the illustrative embodiment, signals are carried in coplanar waveguides on a surface of a quantum processor die. A ground ring surrounds the signals and is connected to the ground conductors of each coplanar waveguide. Wire bonds connect the ground ring to a ground of a circuit board. The wire bonds provide both an electrical connection from the quantum processor die to the circuit board as well as increased thermal coupling between the quantum processor die and the circuit board, increasing cooling of the quantum processor die.

Abstract: Technologies for impedance matching networks for qubits are disclosed. In one illustrative embodiment, an impedance matching network matches a 50 Ohm transmission line to a spin qubit with a state-dependent resistance of 100 kiloohms to 105 kiloohms. The illustrative impedance matching network is tunable, allowing the impedance transformation ratio to be changed without significantly changing the matching frequency of the impedance matching network. In some embodiments, the impedance matching network matches a 50 Ohm transmission line to a lower-resistance state of a qubit. In other embodiments, the impedance matching network matches a 50 Ohm transmission line to an impedance value in between a lower-resistance state and a higher-resistance state of a qubit.

Abstract: The present invention includes a solvent system comprising a pristine nanoparticle solute suspended in a liquid solvent. The solute is selected from the group consisting of a metal oxide, a mixed metal oxide, a chalcogenide, and a mixed metal chalcogenide; and the solvent system is characterized by a value of chi less than about 0.00.