Abstract: An EMI shielding assembly includes an elongated enclosure made of an electrically conductive material and having a plurality of interconnected walls arranged in a polygonal configuration to surround an electronic component on a circuit board, a plurality of mounting pins attached to lower portions of the walls and extending downwardly from a lower edge thereon for attachment to the circuit board, and plurality of inner and outer tabs formed in upper portions of the walls which extend upwardly from the lower portions thereof. The inner and outer tabs are disposed in spaced apart, alternating and offset relationship with respect to one another along the upper portions of the walls so as to create an annular channel therebetween which extends around the enclosure along the upper portions of the interconnected walls thereof.