Abstract: A spinal implant is provided and includes a body portion defining a longitudinal axis. The body portion includes a distal end portion, a proximal end portion, opposed side surfaces that extend between the distal and proximal end portions, and top and bottom surfaces configured and adapted to engage vertebral bodies. The top and bottom surfaces have a surface roughness between 3-4 ?m. A cavity extends through the top and bottom surfaces defining a surface area that is at least 25% of a surface area of the top surface or the bottom surface. First orifices are defined through the top surface and second orifices are defined through the bottom surface. The second orifices are connected to the first orifices by a plurality of channel.

Abstract: A fixation system for repairing a pars fracture includes a needle guide configured to be docked on a lamina of the pars, a needle, a guidewire, and a screw assembly. A portion of the needle is configured for insertion through a passage of the needle guide. A portion of the guidewire is configured for insertion through a passage of the needle. The screw assembly includes a collar and an elongated portion, the collar being movable with respect to the elongated portion. A portion of the screw assembly is configured to contact the lamina co-axially with the guidewire.

Abstract: A method of repairing a pars fracture includes docking a needle guide on a lamina of the pars, inserting a needle at least partially through the needle guide, inserting a stylet at least partially through the needle, inserting a guidewire at least partially through the needle, removing the needle from the needle guide, removing the needle guide, positioning a screw assembly in contact with the lamina and co-axially with the guidewire, rotating an elongated portion of the screw assembly with respect to the lamina to move the screw assembly distally with respect to the lamina such that a distal end of the elongated portion of the screw assembly travels through an interior portion of the pars and into a superior portion of the pars, and approximating the distal end of the elongated portion of the screw assembly and a collar of the screw assembly to approximate the interior portion of the pars and the superior portion of the pars.

Abstract: A spinal implant is provided and includes a body portion defining a longitudinal axis. The body portion includes a distal end portion, a proximal end portion, opposed side surfaces that extend between the distal and proximal end portions, and top and bottom surfaces configured and adapted to engage vertebral bodies. The top and bottom surfaces have a surface roughness between 3-4 ?m. A cavity extends through the top and bottom surfaces defining a surface area that is at least 25% of a surface area of the top surface or the bottom surface. First orifices are defined through the top surface and second orifices are defined through the bottom surface. The second orifices are connected to the first orifices by a plurality of channel.

Abstract: A spinal implant is provided and includes a body portion defining a longitudinal axis. The body portion includes a distal end portion, a proximal end portion, opposed side surfaces that extend between the distal and proximal end portions, and top and bottom surfaces configured and adapted to engage vertebral bodies. The top and bottom surfaces have a surface roughness between 3-4 ?m. A cavity extends through the top and bottom surfaces defining a surface area that is at least 25% of a surface area of the top surface or the bottom surface. First orifices are defined through the top surface and second orifices are defined through the bottom surface. The second orifices are connected to the first orifices by a plurality of channel.

Abstract: A method of repairing a pars fracture includes docking a needle guide on a lamina of the pars, inserting a needle at least partially through the needle guide, inserting a stylet at least partially through the needle, inserting a guidewire at least partially through the needle, removing the needle from the needle guide, removing the needle guide, positioning a screw assembly in contact with the lamina and co-axially with the guidewire, rotating an elongated portion of the screw assembly with respect to the lamina to move the screw assembly distally with respect to the lamina such that a distal end of the elongated portion of the screw assembly travels through an interior portion of the pars and into a superior portion of the pars, and approximating the distal end of the elongated portion of the screw assembly and a collar of the screw assembly to approximate the interior portion of the pars and the superior portion of the pars.

Abstract: A spinal implant is provided and includes a body portion defining a longitudinal axis. The body portion includes a distal end portion, a proximal end portion, opposed side surfaces that extend between the distal and proximal end portions, and top and bottom surfaces configured and adapted to engage vertebral bodies. The top and bottom surfaces have a surface roughness between 3-4 ?m. A cavity extends through the top and bottom surfaces defining a surface area that is at least 25% of a surface area of the top surface or the bottom surface. First orifices are defined through the top surface and second orifices are defined through the bottom surface. The second orifices are connected to the first orifices by a plurality of channel.

Abstract: A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.

Abstract: A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.

Abstract: A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.

Abstract: A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.

Abstract: A probe card having reliable “micro probe” contacts which include a base and an angled probe tip fabricated as a single unit from a thin sheet of a conductive metal having high tensile and yield strength, and coated with a noble metal. The micro probes are secured into precisely dimensioned, and positioned locations on the card, and are electrically connected to traces on the card. Design of the micro probes includes not only the base and probe tip, but also locking features, a stand-off to prevent over compression, and a necked down stem feature for release from the support strap used in transporting and plating during the manufacturing processes.

Abstract: An inexpensive and accurate probe card for testing integrated circuits such as DSPs and the like which have solder ball contact points as manufactured by using a commercially available wire bonding machine. Conductive members or stud bumps are deposited or bonded to conductive pads formed on an insulating substrate. According to one embodiment, three stud bumps are formed on each pad to create an interconnecting nest to receive these solder ball contacts.

Abstract: A probe card having multiple planes with continuous metal traces from a high density of small, robust probe contacts to peripheral vias which enable connection to a test head is fabricated using technology from the printed circuit card industry. The card includes a relatively small, centrally located recessed plane having a plurality of probe contacts precisely patterned to mate with chip contacts, an array of continuous conductive traces, the substrate is folded at specific crease locations, and formed upward to a second array of creases at which the substrate is bent to form a raised plane parallel to the first.

Abstract: A test structure that is readily and inexpensively configurable to interface with dies having different bond pad configurations is achieved by providing a blank test membrane having a conductive coating or a matrix of conductive lines formed thereon. Once a die bond pad configuration is known, the test membrane can be configured for the die bond pads by using a laser under software control to define connection pads correlating to the die bond pads and also to define interconnecting conductive traces from the connecting pads to contact pads that can be connected to test equipment. In one embodiment, the laser operates to ablate a continuous conductive coating, so as to form conductive pads and traces. In another embodiment, the laser is used to cut various lines in a matrix of conductive lines, so as to define conductive paths from the bond pads to the contact pads for connection to the test equipment.

Abstract: A test structure that is readily and inexpensively configurable to interface with dies having different bond pad configurations is achieved by providing a blank test membrane having a conductive coating or a matrix of conductive lines formed thereon. Once a die bond pad configuration is known, the test membrane can be configured for the die bond pads by using a laser under software control to define connection pads correlating to the die bond pads and also to define interconnecting conductive traces from the connecting pads to contact pads that can be connected to test equipment. In one embodiment, the laser operates to ablate a continuous conductive coating, so as to form conductive pads and traces. In another embodiment, the laser is used to cut various lines in a matrix of conductive lines, so as to define conductive paths from the bond pads to the contact pads for connection to the test equipment.

Abstract: A probe card having reliable “micro probe” contacts which include a base and an angled probe tip fabricated as a single unit from a thin sheet of a conductive metal having high tensile and yield strength, and coated with a noble metal. The micro probes are secured into precisely dimensioned, and positioned locations on the card, and are electrically connected to traces on the card. Design of the micro probes includes not only the base and probe tip, but also locking features, a stand-off to prevent over compression, and a necked down stem feature for release from the support strap used in transporting and plating during the manufacturing processes.

Abstract: A test structure that is readily and inexpensively configurable to interface with dies having different bond pad configurations is achieved by providing a blank test membrane having a conductive coating or a matrix of conductive lines formed thereon. Once a die bond pad configuration is known, the test membrane can be configured for the die bond pads by using a laser under software control to define connection pads correlating to the die bond pads and also to define interconnecting conductive traces from the connecting pads to contact pads that can be connected to test equipment. In one embodiment, the laser operates to ablate a continuous conductive coating, so as to form conductive pads and traces. In another embodiment, the laser is used to cut various lines in a matrix of conductive lines, so as to define conductive paths from the bond pads to the contact pads for connection to the test equipment.

Abstract: A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.