Patents by Inventor Leung Chung Wai

Leung Chung Wai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WATER-BASED MOLDABLE MODELING DOUGH AND METHOD PREPARING THEREFOR
    Publication number: 20100190887
    Abstract: A water-based moldable modeling dough includes polyvinyl alcohol (PVA), vinyl acetate resin, water, maltose, maltitol, and hollow microspheres each with a diameter about 5-100 ?m.
    Type: Application
    Filed: January 23, 2009
    Publication date: July 29, 2010
    Applicant: HUIZHOU SEASOAR ART SUPPLIES CO., LTD.
    Inventor: Leung Chung Wai