Abstract: The operating rate of an electronic system is maximized without exceeding a thermal constraint, such as a maximum junction temperature of an integrated circuit (IC) or other portion of the electronic system. An operating parameter of the system that controls the thermal output of the system is calculated for an upcoming time period based upon the previously measured thermal performance relationship to the operating parameter level. If the predicted thermal performance will exceed a maximum allowable level of the thermal constraint, then the operating parameter is reduced by an amount calculated to keep the thermal constraint at a level just below the maximum allowable level, thus resulting in an optimal control approach to maximizing the system performance while not exceeding the thermal constraint.

Abstract: Briefly, some embodiments of the invention may provide devices, systems and methods for thermal control. For example, a method in accordance with an embodiment of the invention may include modifying an operational parameter of a processor based on a temperature of a heat sink associated with the processor.

Abstract: Briefly, a method to control a temperature of a processor and a processor that includes a thermal controller to control a temperature. The thermal controller may decrease the power level of the processor to a first power level for a first predetermined time period and may vary the power of the processor to a second power level for a second predetermined time period.

Abstract: The operating rate of an electronic system is maximized without exceeding a thermal constraint, such as a maximum junction temperature of an integrated circuit (IC) or other portion of the electronic system. An operating parameter of the system that controls the thermal output of the system is calculated for an upcoming time period based upon the previously measured thermal performance relationship to the operating parameter level. If the predicted thermal performance will exceed a maximum allowable level of the thermal constraint, then the operating parameter is reduced by an amount calculated to keep the thermal constraint at a level just below the maximum allowable level, thus resulting in an optimal control approach to maximizing the system performance while not exceeding the thermal constraint.

Abstract: Methods, apparatus, and articles of manufacture control a device or system that has an operational limit related to the rate or frequency of operation. The frequency of operation is controlled at a variable rate calculated to maximize the system or apparatus performance over a calculated period of time short enough that a controlling factor, such as power consumption, does not vary significantly during the period. Known system parameters, such as thermal resistance and capacitance of an integrated circuit (IC) and its package, and measured values, such as current junction temperature in an IC, are used to calculate a time-dependent frequency of operation for the upcoming time period that results in the best overall performance without exceeding the operational limit, such as the junction temperature.

Abstract: Methods, apparatus, and articles of manufacture control a device or system that has an operational limit related to the rate or frequency of operation. The frequency of operation is controlled at a variable rate calculated to maximize the system or apparatus performance over a calculated period of time short enough that a controlling factor, such as power consumption, does not vary significantly during the period. Known system parameters, such as thermal resistance and capacitance of an integrated circuit (IC) and its package, and measured values, such as current junction temperature in an IC, are used to calculate a time-dependent frequency of operation for the upcoming time period that results in the best overall performance without exceeding the operational limit, such as the junction temperature.

Abstract: Systems and methods of thermal management provide for dynamically the upper and lower operating points of a throttled device such as a processor. In one embodiment, it is determined that the temperature of the processor is below a threshold and moving the upper operating point and the lower operating point toward one another.

Abstract: A method and system to profile unconstrained power of a CPU are provided. The method includes identifying a rate of power constraining in the CPU, identifying a threshold to activate power constraining, and determining unconstrained power of the CPU based on the rate of power constraining and the threshold.

Abstract: Briefly, some embodiments of the invention may provide devices, systems and methods for thermal control. For example, a method in accordance with an embodiment of the invention may include modifying an operational parameter of a processor based on a temperature of a heat sink associated with the processor.

Abstract: Briefly, a method to control a temperature of a processor and a processor that includes a thermal controller to control a temperature. The thermal controller may decrease the power level of the processor to a first power level for a first predetermined time period and may vary the power of the processor to a second power level for a second predetermined time period.

Abstract: Methods, apparatus, and articles of manufacture control a device or system that has an operational limit related to the rate or frequency of operation. The frequency of operation is controlled at a variable rate calculated to maximize the system or apparatus performance over a calculated period of time short enough that a controlling factor, such as power consumption, does not vary significantly during the period. Known system parameters, such as thermal resistance and capacitance of an integrated circuit (IC) and its package, and measured values, such as current junction temperature in an IC, are used to calculate a time-dependent frequency of operation for the upcoming time period that results in the best overall performance without exceeding the operational limit, such as the junction temperature.

Abstract: A method of determining whether a test sample belongs to the same individual as a plurality of reference samples. The method includes providing respective values of one or more identifying features from the test sample and the plurality of reference samples, representing the test and reference samples by respective points having coordinates in a multi-dimensional space indicative of the respective feature values, and deciding whether the test sample belongs to the same individual as the plurality of reference samples based on a geometrical property of the points.

Abstract: A method and system for classification, including the steps of searching a data structure including categories for elements related to an input, calculating statistics describing the relevance of each of the elements to the input, ranking the elements by relevance to the input, determining if the ranked elements exceed a threshold confidence value, and returning a set of elements from the ranked elements when the threshold confidence value is exceeded.

Abstract: A method for locating a structured field in a gray-scale image of an object, including choosing a plurality of anchor points in the image, each anchor point having a gray-scale value associated therewith. For each anchor point there is determined a horizontal variation dependent on a difference between the gray-scale value of the anchor point and the gray-scale value of a horizontally neighboring anchor point, and there is also determined a vertical variation dependent on a difference between the gray-scale value of the anchor point and the gray-scale value of a vertically neighboring anchor point. Those anchor points whose vertical and horizontal variations obey a first or a second predefined condition are defined as vertically or horizontally dominant respectively.