Patents by Inventor Lev Katsenelenson

Lev Katsenelenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to provide microstructure for encapsulated high-brightness LED chips
    Patent number: 8778706
    Abstract: Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: July 15, 2014
    Assignee: Luminit LLC
    Inventors: Philip Yi Zhi Chu, Stanley Tafeng Kao, Lev Katsenelenson
  • Method to Provide Microstructure for Encapsulated Hgh-Brightness LED Chips
    Publication number: 20110108874
    Abstract: Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.
    Type: Application
    Filed: November 5, 2010
    Publication date: May 12, 2011
    Applicant: Luminit, LLC
    Inventors: Philip Yi Zhi Chu, Stanley Tafeng Kao, Lev Katsenelenson