Patents by Inventor Lev LAVY

Lev LAVY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10912494
    Abstract: A sensor interface circuit enables signal reconstruction on data received from a sensor prior to sending the data to various sensor clients. Multiple sensor clients have different frequencies configured to receive sensor data. The sensor interface circuit performs signal reconstructions including data interpolation to generate interpolated data signal having frequencies corresponding to the different frequencies configured for the different sensor clients. Signal reconstruction can also include filtering the data. The sensor interface circuit sends the reconstructed data to the multiple clients in accordance with their different frequencies.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: February 9, 2021
    Assignee: Intel Corporation
    Inventors: Ke Han, Dong Wang, He Han, Dror Lederman, Lev Lavy, Yehiel Shilo
  • Publication number: 20180353106
    Abstract: A sensor interface circuit enables signal reconstruction on data received from a sensor prior to sending the data to various sensor clients. Multiple sensor clients have different frequencies configured to receive sensor data. The sensor interface circuit performs signal reconstructions including data interpolation to generate interpolated data signal having frequencies corresponding to the different frequencies configured for the different sensor clients. Signal reconstruction can also include filtering the data. The sensor interface circuit sends the reconstructed data to the multiple clients in accordance with their different frequencies.
    Type: Application
    Filed: August 10, 2016
    Publication date: December 13, 2018
    Inventors: Ke HAN, Dong WANG, He HAN, Dror LEDERMAN, Lev LAVY, Yehiel SHILO
  • Publication number: 20150216442
    Abstract: A system for spatial impedance imaging includes a multi-layer coaxial probe for spatial impedance imaging. The multi-layer coaxial probe includes: an elongated core having a distal end and a proximal end; a first coating layer wrapping around the core; a set of alternating conductive and insulating coating layers on top of said first coating layer, wherein an Nth coating layer is shorter than an N-1th coating layer beneath it. The elongated core includes a needle or other suitable elongated member.
    Type: Application
    Filed: July 23, 2013
    Publication date: August 6, 2015
    Inventors: Lev LAVY, Itai HAYUT