Abstract: Systems and methods for providing increased CMUT imaging performance are disclosed. The system can comprise CMUT electronics with integrated or derived gap feedback. In this manner, the response of the CMUT membrane can be linearized to improve pressure output and/or harmonic distortion. The system can comprise a CMUT with series resistance to improve linearity. The system can also comprise a CMUT with series induction-resistance for improved linearity at reduced voltages. A method for linearizing CMUT response is also disclosed. The method can comprise providing a signal to the CMUT that is inversely proportional the gap between the CMUT membrane and the substrate on which the CMUT is fabricated.

Abstract: Capacitive micromachined ultrasonic transducer (“CMUT”) devices and fabrication methods are provided. The CMUT devices can include integrated circuit devices utilizing direct connections to various CMOS electronic components. The use of integrated connections can reduce overall package size and improve functionality for use in ultrasonic imaging applications. CMUT devices can also be manufactured on multiple silicon chip layers with each layer connected utilizing through silicon vias (TSVs). External power connections can be provided if high biasing voltages are required. Forward and side looking CMUT arrays can be manufactured for use in a variety of ultrasound technologies.