Patents by Inventor Levin Li

Levin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for overmolding of decorated plastic parts
    Patent number: 8552292
    Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 8, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Jeff Qin, Charles R. Hill, Suriaprakash Narotamo, Levin Li, Spring Wu, Zhong Wang