Abstract: The present invention provides an apparatus comprising a device and a means for heat transfer comprising a hydrofluoroether heat-transfer fluid wherein the heat transfer fluid is 3-ethoxy-perfluoro(2-methylhexane). Another embodiment of the present invention is a method therefor.

Abstract: A thermal transfer apparatus adapted for thermal connection to a heat source for conducting heat away from the heat source. The thermal transfer apparatus includes a container which is substantially impermeable to fluid and forms an expandable compartment that is substantially gas-free. A thermal transfer liquid is positioned within the expandable compartment for thermal connection to the heat source. The thermal transfer liquid has a boiling point that is at or below an operating temperature of the heat source. When the heat source is in a non-operating state, the thermal transfer liquid is compressed and substantially fills the expandable compartment. When the heat source is in an operating state, the thermal transfer liquid conducts heat from the heat source. The liquid vaporizes and forms a vapor within the expandable compartment which causes the expandable compartment to expand and create a vapor space above the liquid.

Abstract: A unitary jet impingement plate is formed including a body portion thereof and at least one manifold integrally connected with the body portion, each having internal passages in fluidic communication with one another. At least one jet impingement orifice is provided through a plate of the body portion of the jet impingement plate through which heat transfer fluid can be directed into a fluid jet of such heat transfer fluid from the jet impingement plate and for impinging on a component or object to the thermally effected thereby. The heat transfer fluid may be heated or cooled as required depending on the specific application. Preferably, the jet impingement plate is structurally enhanced by the provision of integral posts provided in a pattern within the body portion of the jet impingement plate. More preferably, a plurality of jet impingement orifices are provided in accordance with a predetermined pattern designed for a particular application.

Abstract: Semi-rigid heat transfer devices are provided for heating or cooling components, such as electrical components, wherein the heat transfer devices are sufficiently flexible to conform to the shapes of the components, but are sufficiently rigid to maintain its overall structual shape. Moreover, the heat transfer devices include at least a frame or support portion thereof and a layer of flexible film. The frame and film layer are advantageously heat sealable according to one aspect of the present invention. The degree of flexibility for a particular heat transfer device can be designed in accordance with the specific requirements of particular applications.

Abstract: A heat transfer apparatus especially useful for cooling electronic components has a frame with a channel for the flow of heat transfer liquid, a flexible sheet connected to the frame, and a thermal via coupled to the sheet. As fluid flows through the channel, the sheet and via move outwardly for contact with the component to be cooled. A cover structure extends across the frame adjacent the via and limits outward movement of the sheet. The cover structure also prevents damage to the sheet when the apparatus is handled.

Abstract: A heat transfer bag especially useful for cooling electronic components is made of a flexible sheet of material and is filled with a fluorochemical heat transfer liquid. A metallic thermal via extends through a hole in the bag for direct contact with an external surface of a heat-generating component. A portion of the via extends into the bag and functions as a heat radiating fin to enhance the transfer of heat from the component to the liquid within the bag.