Patents by Inventor Lewis Chu

Lewis Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132507
    Abstract: Presently provided are inhibitors of TD02 and IDO1 and pharmaceutical compositions thereof, useful for modulating an activity of tryptophan 2,3 dioxygenase and indoleamine 2,3-dioxygenase 1; treating immunosuppression; treating a medical conditions that benefit from the inhibition of tryptophan degradation; enhancing the effectiveness of an anti-cancer treatment comprising administering an anti-cancer agent; and treating tumor-specific immunosuppression associated with cancer.
    Type: Application
    Filed: October 27, 2023
    Publication date: April 25, 2024
    Inventors: Zhonghua Pei, Brendan Parr, Wendy Liu, Richard Pastor, Lewis Gazzard, Firoz Jaipuri, Sanjeev Kumar, Hima Potturi, Guoshen Wu, Xingyu Lin, Yanyan Chu, Po-wai Yuen
  • Publication number: 20090236351
    Abstract: A hanger may include a body for supporting a package from a rod. A support portion may extend from the body and may define a gap to receive the rod. The body may define a slot for receiving the tab and may include a first major face that fully encloses the slot. The body may also include a living hinge defining a fold axis. The living hinge may extend across the first major face on opposite sides of the slot and extend inline with the slot. In some examples, the support portion defines a J-hook. In some examples, the hanger is incorporated into a package assembly including a package configured to house a product and including a tab, wherein the tab extends through the slot to support the package from the rod with the hanger.
    Type: Application
    Filed: December 31, 2008
    Publication date: September 24, 2009
    Inventors: Lewis CHU, Kenny Lau
  • Patent number: 7565635
    Abstract: SiP design systems and methods. The system comprises a system partitioning module, a subsystem integration module, a physical design module, and an analysis module. The system partitioning module partitions a target system into subsystem partitions according to partition criteria. The subsystem integration module generates an architecture design and/or a cost estimation for the target system according to the subsystem partitions, at least one SiP platform, and IC geometry data. The physical design module generates a SiP physical design with physical routing for the target system according to the architecture design, the subsystem partitions, the SiP platform, and the IC geometry data. The analysis module performs a performance check within the subsystem partitions based on the SiP physical design and/or simulations of the target system.
    Type: Grant
    Filed: April 9, 2007
    Date of Patent: July 21, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Clinton Chao, Louis Liu, Lewis Chu, Mark Shane Peng, Chao-Shun Hsu, Kim Chen
  • Publication number: 20080250182
    Abstract: SiP design systems and methods. The system comprises a system partitioning module, a subsystem integration module, a physical design module, and an analysis module. The system partitioning module partitions a target system into subsystem partitions according to partition criteria. The subsystem integration module generates an architecture design and/or a cost estimation for the target system according to the subsystem partitions, at least one SiP platform, and IC geometry data. The physical design module generates a SiP physical design with physical routing for the target system according to the architecture design, the subsystem partitions, the SiP platform, and the IC geometry data. The analysis module performs a performance check within the subsystem partitions based on the SiP physical design and/or simulations of the target system.
    Type: Application
    Filed: April 9, 2007
    Publication date: October 9, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Clinton Chao, Louis Liu, Lewis Chu, Mark Shane Peng, Chao-Shun Hsu, Kim Chen