Patents by Inventor Lewis H. Little

Lewis H. Little has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8375778
    Abstract: An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: February 19, 2013
    Assignee: Delphi Technologies, Inc.
    Inventors: Hamid R. Borzabadi, Ronald D. Wilcox, Philip D. Kuznia, Timothy A. Vas, Lewis H. Little, David G. Miller
  • Publication number: 20110203359
    Abstract: An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.
    Type: Application
    Filed: February 22, 2010
    Publication date: August 25, 2011
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: HAMID R. BORZABADI, RONALD D. WILCOX, PHILIP D. KUZNIA, TIMOTHY A. VAS, LEWIS H. LITTLE, DAVID G. MILLER
  • Patent number: 5629486
    Abstract: A pressure sensor comprises a diaphragm mounted on a housing and subject to pressure. Stress sensitive resistors are connected to circuit traces on the diaphragm which in turn are wirebonded to a compensation IC. The IC is directly mounted on the diaphragm principally or wholly in an area which is not subject to flexing. A connector has a dome partially covering the diaphragm and holds terminal blades having ends extending away from the diaphragm and opposite ends carrying bond pads located adjacent the diaphragm. An opening in the dome permits wirebonder access to connect bond pads on the traces with terminal bond pads. A cover is installed over the connector and sensor.
    Type: Grant
    Filed: January 25, 1996
    Date of Patent: May 13, 1997
    Assignee: Delco Electronics Corporation
    Inventors: Andres D. Viduya, Lewis H. Little