Patents by Inventor Lewis R. Dov

Lewis R. Dov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method to form ground connections
    Patent number: 6867669
    Abstract: Method and apparatus for interfacing a circuit, such as a microcircuit, with an IC. The circuit is formed on a thick film dielectric structure supported by a substrate having a cut out to receive the IC. A ground plane is formed on the substrate. The thick film dielectric structure abuts the cut out with an area having at least two projections forming at least one recess, the edge of the recess having a conductive layer in electrical communication with the ground plane. A conductive pad on top of the dielectric structure is in electrical communication with the conductive layer in the recess. A ground connection on the IC is connected to the conductive pad thereby grounding the IC.
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: March 15, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Lewis R. Dov, John F. Casey
  • Apparatus and method to form ground connections
    Publication number: 20040257179
    Abstract: Method and apparatus for interfacing a circuit, such as a microcircuit, with an IC. The circuit is formed on a thick film dielectric structure supported by a substrate having a cut out to receive the IC. A ground plane is formed on the substrate. The thick film dielectric structure abuts the cut out with an area having at least two projections forming at least one recess, the edge of the recess having a conductive layer in electrical communication with the ground plane. A conductive pad on top of the dielectric structure is in electrical communication with the conductive layer in the recess. A ground connection on the IC is connected to the conductive pad thereby grounding the IC.
    Type: Application
    Filed: June 23, 2003
    Publication date: December 23, 2004
    Inventors: Lewis R. Dov, John F. Casey