Abstract: A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

Abstract: A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

Abstract: An electrical connector configured for differential pairs with low in-pair skew. The connector may comprise lead frame assemblies, such as insert molded lead frame assemblies, with adjacent conductors configured for reduced skew by distributing skew correction throughout the transmission path through the lead frame assembly. Elongated air gaps are formed in a side of the housing, exposing the longer conductor of each pair. The elongated air gap may span the entire length of the arc of a longer conductor of each pair. The width of this air gap may be different for different pairs in the lead frame assembly and may be selected to cancel or prevent in-pair skew from arising. The width for each pair may be selected to tune the effective dielectric constant of the longer conductor such that its electrical length matches that of the shorter conductor.

Abstract: A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

Abstract: A connector for surface mounting with a solder reflow process with solder masses fused to mounting ends of contacts exposed in a mounting surface of the connector. The solder masses may be attached to edges of the mounting ends using a pin transfer method to apply flux to the edges. The edges may have a concave shape to both increase the length of the edge to which the solder masses are attached and position the solder masses with respect to the mounting ends. Solder paste may be omitted in attaching the solder balls to the contacts, reducing the capacitance of the contact and promoting uniformity of the impedance of the signal paths through the mounting interface of the connector.

Abstract: An electrical connector configured for differential pairs with low in-pair skew. The connector may comprise lead frame assemblies, such as insert molded lead frame assemblies, with adjacent conductors configured for reduced skew by distributing skew correction throughout the transmission path through the lead frame assembly. Elongated air gaps are formed in a side of the housing, exposing the longer conductor of each pair. The elongated air gap may span the entire length of the arc of a longer conductor of each pair. The width of this air gap may be different for different pairs in the lead frame assembly and may be selected to cancel or prevent in-pair skew from arising. The width for each pair may be selected to tune the effective dielectric constant of the longer conductor such that its electrical length matches that of the shorter conductor.

Abstract: A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

Abstract: A connector for surface mounting with a solder reflow process with solder masses fused to mounting ends of contacts exposed in a mounting surface of the connector. The solder masses may be attached to edges of the mounting ends using a pin transfer method to apply flux to the edges. The edges may have a concave shape to both increase the length of the edge to which the solder masses are attached and position the solder masses with respect to the mounting ends. Solder paste may be omitted in attaching the solder balls to the contacts, reducing the capacitance of the contact and promoting uniformity of the impedance of the signal paths through the mounting interface of the connector.

Abstract: An electrical connector assembly includes first and second mezzanine electrical connectors that include respective first and second arrays of electrical contacts. The electrical contacts can be receptacle, or one can be a plug and the other can be a receptacle. Each electrical connector can further include at least one alignment member that cooperate to align the first and second arrays of electrical contacts relative to each other. Each electrical connector can further include at least one orientation member that allows the first and second electrical connectors to mate when in a predetermined orientation relative to each other.

Abstract: An electrical connector assembly includes first and second mezzanine electrical connectors that include respective first and second arrays of electrical contacts. The electrical contacts can be receptacle, or one can be a plug and the other can be a receptacle. Each electrical connector can further include at least one alignment member that cooperate to align the first and second arrays of electrical contacts relative to each other. Each electrical connector can further include at least one orientation member that allows the first and second electrical connectors to mate when in a predetermined orientation relative to each other.

Abstract: An electrical connector assembly includes first and second mezzanine electrical connectors that include respective first and second arrays of electrical contacts. The electrical contacts can be receptacle, or one can be a plug and the other can be a receptacle. Each electrical connector can further include at least one alignment member that cooperate to align the first and second arrays of electrical contacts relative to each other. Each electrical connector can further include at least one orientation member that allows the first and second electrical connectors to mate when in a predetermined orientation relative to each other.

Abstract: An electrical connector assembly includes first and second mezzanine electrical connectors that include respective first and second arrays of electrical contacts. The electrical contacts can be receptacle, or one can be a plug and the other can be a receptacle. Each electrical connector can further include at least one alignment member that cooperate to align the first and second arrays of electrical contacts relative to each other. Each electrical connector can further include at least one orientation member that allows the first and second electrical connectors to mate when in a predetermined orientation relative to each other.

Abstract: An electrical connector with at least two connector portions. A first connector portion and a second connector portion may each be mountable on a respective surface, such as a printed circuit board. The first and second connector portions may each include a housing. The housing of the first connector portion may include a bore and an adjacent pin. The housing of the second connector portion may also include a bore and an adjacent pin. The pin of the first connector portion may be received in the bore of the second connector portion, and the pin of the second connector portion may be received in the bore of the first connector portion, when the two connector portions are mated to one another. In one embodiment, the first and second connector portions may be substantially identical to one another.

Abstract: Embodiments of electrical connectors include substantially identical first and second halves. The first and second halves each include insert molded leadframe assemblies that comprise electrical conductors. Each electrical conductor of the first half engages a substantially identical electrical conductor of the second half when the first and second halves are mated.