Abstract: The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass.

Abstract: The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass.

Abstract: The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass.

Abstract: An integrated current sensor is provided in the present invention. The integrated current sensor includes: a conductor comprising at least one current input pin, at least one current output pin, a first leg portion connected to the at least one current input pin, a second leg portion connected to the at least one current output pin, and a connection portion connected between the first leg portion and the second leg portion; a magnetoresistive sensing and signal processing unit; an isolation unit configured to be sandwiched between the magnetoresistive sensing and signal processing unit and the conductor; a plurality of signal pins configured for being coupled to the magnetoresistive sensing and signal processing unit via wires respectively; and a package body configured for wrapping part of the conductor, part of the signal pins, the isolation unit and the magnetoresistive sensing and signal processing unit.

Abstract: The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass.

Abstract: A linearity compensation circuit is disclosed for improving the linearity of a sensing signal. The linearity compensation circuit may include a compensator that is capable of receiving a sensing signal from a sensor and generating a compensation signal based on the sensing signal. The linearity compensation circuit may also include an output circuit that is capable of combining the compensation signal and the sensing signal to generate a compensated signal that exhibits an improved linearity. Also disclosed is a sensing apparatus which includes a sensor and the linearity compensation circuit. The sensing apparatus may thus be able to generate a sensing signal that is linear over a wider dynamic range.

Abstract: The present invention relates to a coil and a manufacturing method thereof. The method includes: depositing a first metal layer on a first surface of a wafer and patterning the first metal layer to obtain a first patterned metal layer on the first surface; etching a plurality of through holes on a second surface of the wafer to the first surface of the wafer, and depositing a second metal layer on the second surface of the etched wafer and patterning the second metal layer to obtain a plurality of through hole metals and a second patterned metal layer on the second surface; and, dicing the wafer to obtain a plurality of independent coils. Each coil comprises the first patterned metal layer, the through hole metals and the second patterned metal layer. The first patterned metal layer is coupled with the second patterned metal layer through the through hole metals. Thus, high-precision coils can be efficiently manufactured in batches and at low costs through a wafer level process.

Abstract: The present invention provides a glass isolation device and a method for manufacturing the glass isolation device, and a current sensor. The current sensor comprises: a conductor, comprising a current input terminal, a current output terminal, a first leg portion connected to the current input terminal, a second leg portion connected to the current output terminal, and a connection portion connected between the first leg portion and the second leg portion; a magnetoresistive sensing device; and an isolation device disposed between the magnetoresistive sensing device and the conductor and comprising an insulating substrate and a conductive thin film formed on the insulating substrate. The conductive thin film is grounded through a wire, and currents on the first leg portion and the second leg portion are in opposite directions.

Abstract: An integrated current sensor is provided in the present invention. The integrated current sensor includes: a conductor comprising at least one current input pin, at least one current output pin, a first leg portion connected to the at least one current input pin, a second leg portion connected to the at least one current output pin, and a connection portion connected between the first leg portion and the second leg portion; a magnetoresistive sensing and signal processing unit; an isolation unit configured to be sandwiched between the magnetoresistive sensing and signal processing unit and the conductor; a plurality of signal pins configured for being coupled to the magnetoresistive sensing and signal processing unit via wires respectively; and a package body configured for wrapping part of the conductor, part of the signal pins, the isolation unit and the magnetoresistive sensing and signal processing unit.

Abstract: A method involves a first magnetic sensor of a magnetic apparatus measuring an external magnetic field. The method also involves a signal processing circuit of the apparatus performing calibration using a second sensor in response to the external magnetic field. The first sensor and the second sensor are formed on the same substrate. There will be at least one magnetic sensor is used to measure the external magnetic field, and the other magnetic sensor is used in calibration, and therefore, the method ensures an effective output signal can be generated during calibration and enhances the accuracy of the measurement.

Abstract: A linearity compensation circuit is disclosed for improving the linearity of a sensing signal. The linearity compensation circuit may include a compensator that is capable of receiving a sensing signal from a sensor and generating a compensation signal based on the sensing signal. The linearity compensation circuit may also include an output circuit that is capable of combining the compensation signal and the sensing signal to generate a compensated signal that exhibits an improved linearity. Also disclosed is a sensing apparatus which includes a sensor and the linearity compensation circuit. The sensing apparatus may thus be able to generate a sensing signal that is linear over a wider dynamic range.

Abstract: The present disclosure discloses a method for wafer-level chip scale packaged wafer testing. The method comprises: dicing a wafer-level chip scale packaged wafer into a plurality of wafer strips each comprising a plurality of un-diced chip scale packaged devices; fixing the wafer strips onto a plurality of corresponding strip carriers respectively; testing the chip scale packaged devices of the wafer strips fixed onto the strip carriers by a testing equipment; and dicing the tested wafer strips into a plurality of individual chip scale packaged devices. Since the proposed method does not involve loading a multitude of diced chips into sockets one by one, but that a limited number of wafer strips are loaded onto corresponding strip carriers, flow jam is avoided.

Abstract: A three-axis magnetic sensor or magnetometer is provided. Two magnetic sensor Wheatstone bridges using barber pole AMR structures are fabricated on opposite sides of a bump structure formed on a substrate to provide surfaces that are at a predetermined angle with respect to the flat surface of the substrate. The bridge assembly is oriented along the Y axis and the bridges are interconnected such that Y and Z channel signals can be produced by processing of the bridge signals. The X channel signals are provided by an X axis sensor provided on the level surface of the substrate.

Abstract: The present disclosure discloses a method for wafer-level chip scale packaged wafer testing. The method comprises: dicing a wafer-level chip scale packaged wafer into a plurality of wafer strips each comprising a plurality of un-diced chip scale packaged devices; fixing the wafer strips onto a plurality of corresponding strip carriers respectively; testing the chip scale packaged devices of the wafer strips fixed onto the strip carriers by a testing equipment; and dicing the tested wafer strips into a plurality of individual chip scale packaged devices. Since the proposed method does not involve loading a multitude of diced chips into sockets one by one, but that a limited number of wafer strips are loaded onto corresponding strip carriers, flow jam is avoided.

Abstract: A magnetic field sensor with at least one three-dimensional spiral reset coil, as well as a method of making the same, are provided. The magnetic field sensor comprises at least one sensing unit having a magnetic easy axis and a magneto-sensitive axis perpendicular to the magnetic easy axis, and at least one three-dimensional spiral reset coil spirally surrounding a corresponding sensing unit of the at least one sensing unit. The spiral reset coil comprises a first wire portion disposed on two opposite sides of the corresponding sensing unit, and a third wire portion coupling the first and second wire portions. Compared with a conventional planer reset coil, the three-dimensional spiral reset coil provides a stronger magnetic field under same current. Therefore, a substrate area for fabricating the magnetic field sensors may be utilized more effectively.

Abstract: A magnetic field sensor with an integrated self-test reset wire is provided. The magnetic field sensor includes at least one sensing unit having a magnetic easy axis and a magneto-sensitive axis perpendicular to the magnetic easy axis, and at least one self-test reset wire disposed above or below the at least one sensing unit. A predetermined angle between the self-test reset wire and the magneto-sensitive axis of the corresponding sensing unit is greater than 0 degrees and less than 45 degrees. The self-test reset wire is configured to realize a set-reset function and a self-test function for the magnetic field sensor.

Abstract: The present disclosure provides an anisotropic magnetoresistance (AMR) sensor. The AMR sensor comprises: a substrate layer; a buffer layer disposed on the substrate layer; a cap layer disposed on the buffer layer; and an intermediate layer disposed between the buffer layer and the cap layer and comprising a ferromagnetic layer and an antiferromagnetic layer. A magnetic moment of the ferromagnetic layer is oriented randomly after the ferromagnetic layer is interfered by an external large magnetic field. The magnetic moment of the ferromagnetic layer can be rearranged by an exchange bias between the antiferromagnetic layer and the ferromagnetic layer, such that the magnetic moment of the ferromagnetic layer is oriented uniformly after the ferromagnetic layer is interfered by a large magnetic field, thereby setting a direction of the magnetic moment of the ferromagnetic layer (SET function). A push-pull full bridge circuit based on the above anisotropic magnetoresistance sensor is also provided.

Abstract: A three-axis magnetic sensor or magnetometer is provided. Two magnetic sensor Wheatstone bridges using barber pole AMR structures are fabricated on opposite sides of a bump structure formed on a substrate to provide surfaces that are at a pre-determined angle with respect to the flat surface of the substrate. The bridge assembly is oriented along the Y axis and the bridges are interconnected such that Y and Z channel signals can be produced by processing of the bridge signals. The X channel signals are provided by an X axis sensor provided on the level surface of the substrate.

Abstract: A multi-axis GMR or TGMR based magnetic field sensor system is disclosed. Preferably a three axis sensor system is provided for sensing magnetic flux along three mutually orthogonal axes, which can be used for magnetic compass or other magnetic field sensing applications. The sensing units are operative to sense X and Y axis magnetic flux signals in the device (XY) plane, while Z axis sensitivity is achieved by use of a continuous ring shaped or octagonal magnetic concentrator that is adapted to convert the Z axis magnetic flux signal into magnetic flux signals in the XY plane.

Abstract: A Z-axis capacitive accelerometer includes a substrate, a capacitance sensing plate, a proof mass and at least one pair of spring beams. The capacitance sensing plate includes two symmetrical sense areas to create differential capacitive measurement. A decoupling structure separates the proof mass and the capacitance sensing plate and their rotational motions from each other. In the proposed Z axis capacitive accelerometer, the distance of the capacitance sensing plate relative to its rotation axis is considerably increased, thereby effectively enhancing the sensitivity when measuring the Z-axis acceleration.