Abstract: An electrical conductive structure and an electrical device comprising the electrical conductive structure are provided. The electrical conductive structure comprises a copper foil and at least one wire. The wire is disposed on the surface of the copper foil by spot welding. The electrical conductive structure is adapted to be the primary winding and/or the secondary winding of an inductive component within an electrical device as well as an electromagnetic interference (EMI) shielding between each of the winding. The electrical conductive structure of this invention combines the copper foil and at least one wire by spot welding to decrease the volume of the electrical device and to lower the costs of the assembly process.