Abstract: A process for preparing a modified heat-treated platelet pellet lysate, said process comprising the steps of: a) Providing a platelet pellet lysate, b) Heat-treating the platelet pellet lysate at a temperature of 55° C. to 65° C. during 20 to 40 minutes, c) Purifying the heat-treated platelet pellet lysate of step b) so as to obtain a modified heat treated platelet pellet lysate having a total protein content of less than 70% of the total protein content of the platelet pellet lysate of step a).

Abstract: A wheel detachment monitoring and detection device is to be installed on a vehicle wheel. The wheel detachment monitoring and detection device includes a washer, a housing, a detachment detection module, and a power source. The washer defines a through hole for a fastening member to pass and fix the washer, and has an engaging portion partially covered by the fastening member. The housing gets engaged with the engaging portion and accommodates the detachment detection module. The detachment detection module has a pressure sensing portion that is pressed by the fastening member to press against the vehicle wheel, and detects a pressing force acting thereon. When the pressure sensing portion detects that the pressing force disappears, the detachment detection module sends out a warning signal. The wheel detachment monitoring and detection device ensures attachment of the vehicle wheel by monitoring looseness of the fastening member.

Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.

Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.

Abstract: An electronic device includes: a circuit board, a substrate, a first signal line, a second signal line and a first chip. The substrate has a peripheral area, a first side edge having a first extending direction and a second side edge having a second extending direction not parallel to the first extending direction. The first signal line is disposed on the substrate and in the peripheral area. The second signal line is disposed on the substrate and is adjacent to the first signal line. The chip is disposed on the circuit board and is electrically connected to the first signal line. Wherein, the first signal line has a first section disposed between the second signal line and the first side edge and a second section disposed between the second signal line and the second side edge, and the first section of the first signal line extends along the first extending direction and the second section of the first signal line extends along the second extending direction.

Abstract: An electronic device is provided. The electronic device includes a substrate and a first conductive line disposed on the substrate and including a first section and a second section electrically connected to the first section. The first section has a first minimum width outside the overlapping region, the second section has a second minimum width outside the overlapping region, and the first minimum width is different from the second minimum width. The electronic device further includes a first conductive layer disposed on the first section and the second section. The first section is electrically connected to the second section through the first conductive layer.

Abstract: An electronic device is provided, which includes: a substrate including a periphery region; a plurality of first pads disposed on the substrate and in the periphery region; a plurality of second pads disposed on the substrate and in the periphery region; and a plurality of redundancy pads disposed on the substrate and in the periphery region, wherein the plurality of first pads are configured to transmit a plurality of data signals, the plurality of second pads are configured to transmit a plurality of signals which are different from the plurality of data signals and a plurality of touch signals, and the plurality of first pads and the plurality of redundancy pads are disposed between two of the plurality of second pads.

Abstract: The present invention includes an air cleaning device and a smart power equipment; the air cleaning device includes an air intake device, an air discharge device, an air purifying device, an air extractor device, an ultraviolet light catalyst sterilizing device, and a power supply device electrically connected to the air extractor device and the ultraviolet light catalyst sterilizing device. The smart power equipment is provided with an artificial intelligence movement system, an electric storage, and a charging base that enables docking with the artificial intelligence movement system for charging the electric storage device. The smart power equipment moves and, according to the air pollution level setting, activates the air extractor device to circulate the air while carrying out air purification by means of an ultraviolet light catalyst sterilizing device.

Abstract: An electronic device includes: a substrate, a signal line, a detection line and a detection unit. The substrate has a peripheral area and a substrate edge. The signal line is disposed on the substrate, and the signal line is located in the peripheral area. The detection line is disposed on the substrate, and is adjacent to the signal line. The detection unit is electrically connected to the detection line. Wherein, the detection line is disposed between the signal line and the substrate edge, and the detection line and the signal line are electrically insulated.

Abstract: An electronic device having a peripheral area is provided. The electronic device includes a substrate; and a first conductive line disposed on the substrate in the peripheral area and including a first section and a second section electrically connected to the first section. An overlapping region is defined as a region that the first section overlaps the second section in a top view of the electronic device. The first section has a first minimum width inside the overlapping region and a second minimum width outside the overlapping region. The second section has a third minimum width outside the overlapping region. The first minimum width is greater than the second minimum width and greater than the third minimum width.

Abstract: A semiconductor wafer cleaning solution may include at least a first agent, a second agent, and water. The first agent is configured to chelate residual metals on the semiconductor wafer. The second agent has a solubility of 35 g/100 ml to 45 g/100 ml in water with a pH-value greater than 6 and less than 7 at 20° C., and has an acid dissociation constant between 7 and 8 at 20° C. The pH-value of the cleaning solution is maintained in the range of 6.5 to 8.8 at 20° C. to 70° C. In the cleaning solution, the metal chelating ability of the first agent is greater than that of the second agent.

Abstract: A touch electronic device is provided, which includes: a substrate; a plurality of data fan-out lines disposed on the substrate; a plurality of first data pads disposed on the substrate; a plurality of touch fan-out lines disposed on the substrate; and a plurality of first touch pads disposed on the substrate, wherein one of the plurality of data fan-out lines is electrically connected to one of the plurality of first data pads, one of the plurality of touch fan-out lines is electrically connected to one of the plurality of first touch pads, and any of the plurality of data fan-out lines and any of the touch fan-out lines are not overlapped in a top view direction of the substrate.

Abstract: In some embodiments, an affixed group of pharmaceutical vials with frangible connectors includes: a plurality of pharmaceutical vials arranged as a group of pharmaceutical vials, each of the plurality of pharmaceutical vials shaped and positioned to minimize a total volume of the group of pharmaceutical vials, each of the pharmaceutical vials including at least one external side with a surface configured to reversibly mate with a corresponding external side and a surface of an adjacent pharmaceutical vial; and a plurality of frangible connectors, wherein at least one frangible connector is affixed to the surface of at least two of the plurality of pharmaceutical vials within the group of pharmaceutical vials, and at least one frangible connector is affixed to each of the plurality of pharmaceutical vials.

Abstract: Aspects of the disclosure provide a method. The method includes forming a structure over a substrate, and forming a spacer layer on the structure, wherein the spacer layer has a recess. The method includes forming a mask layer over the spacer layer and in the recess, the mask layer including a first layer, a second layer and a third layer. The method includes patterning the third layer of the mask layer, and etching the first layer and the second layer of the mask layer to form an opening to expose the recess of the spacer layer, wherein the opening in the second layer has a first width; and. The method includes removing the second layer using a wet etchant, wherein the opening in the third layer has a second width, and the second with is greater than the first width.

Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.

Abstract: Portage storage containers including controlled evaporative cooling systems are described herein. In some embodiments, a portable container including an integral controlled evaporative cooling system includes: a storage region, an evaporative region adjacent to the storage region, a desiccant region adjacent to the outside of the container, and an insulation region positioned between the evaporative region and the desiccant region. A vapor conduit with an attached vapor control unit has a first end within the evaporative region and a second end within the desiccant region. In some embodiments, the controlled evaporative cooling systems are positioned in a radial configuration within the portable container.

Abstract: An electronic device is provided. The electronic device includes a panel, a detection system, and a test loop. The test loop is electrically connected to the panel and the detection system. The detection system includes a detection unit and a controller. The detection unit detects a signal transmitted by the test loop, and provides a detection result to the controller.

Abstract: An electronic device includes: a substrate, a signal line, a detection line and a detection unit. The substrate has a peripheral area and a substrate edge. The signal line is disposed on the substrate, and the signal line is located in the peripheral area. The detection line is disposed on the substrate, and is adjacent to the signal line. The detection unit is electrically connected to the detection line. Wherein, the detection line is disposed between the signal line and the substrate edge, and the detection line and the signal line are electrically insulated.

Abstract: A touch electronic device is provided, which includes: a substrate; a plurality of data fan-out lines disposed on the substrate; a plurality of first data pads disposed on the substrate; a plurality of touch fan-out lines disposed on the substrate; and a plurality of first touch pads disposed on the substrate, wherein one of the plurality of data fan-out lines is electrically connected to one of the plurality of first data pads, one of the plurality of touch fan-out lines is electrically connected to one of the plurality of first touch pads, and any of the plurality of data fan-out lines and any of the touch fan-out lines are not overlapped in a top view direction of the substrate.

Abstract: An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber. In an embodiment the semiconductor device is placed on a mounting platform at a first height and an etch process is performed, then the semiconductor device is moved to a second height within the chamber and a second etch process is performed, with the rotational speed of the semiconductor device reduced during movements in order to reduce the chance of cross contamination.