Patents by Inventor Li An

Li An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230236822
    Abstract: Embodiments of this application disclose a data transmission system, including an over the air OTA server, a master electronic control unit ECU, and a node ECU. The master ECU is configured to obtain a size of a target software package from the OTA server. The master ECU is further configured to transmit to a node ECU, the size of the target software package, or obtain a size of a remaining storage space of the node ECU from the node ECU.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 27, 2023
    Inventors: Qiong LIU, Zhen LI, Tao MA, Hongxing SUN
  • Publication number: 20230233027
    Abstract: The present invention provides wireless temperature control turkey fryer which relates to the field of cooking apparatus technologies; the main technical scheme comprises a fryer body, a fryer lid matching the fryer body and an outer ring seat supporting the fryer body. A stove body for heating the bottom of the fryer body is disposed inside the outer ring seat. The stove body is provided with a gas disconnecting piece for cutting off a gas passage. The fryer lid is provided with an electronic thermometer. The electronic thermometer is provided with a temperature insertion pin for being inserted into the fryer body for temperature monitoring. The temperature insertion pin is in communication connection with the gas disconnecting piece such that the gas disconnecting piece is enabled to start and cut off the gas passage when a temperature in the fryer body exceeds a set threshold, achieving convenient temperature control effect.
    Type: Application
    Filed: October 31, 2022
    Publication date: July 27, 2023
    Inventor: Zhaowei LI
  • Publication number: 20230235049
    Abstract: An invention provides a chimeric antigen receptor. The chimeric antigen receptor includes an extracellular domain including a heavy chain variable region, a light chain variable region of a single chain antibody fragment and CD8 hinge region; a transmembrane domain including an immune co-stimulator transmembrane domain; and an intracellular domain including an immune co-stimulator intracellular segment and CD3? chain. According to the embodiments of the invention, the chimeric antigen receptor can specifically recognize the tumor cells expressing the specific antigen and achieve the specific killing effect against the tumor cells expressing the high specific antigen.
    Type: Application
    Filed: August 11, 2020
    Publication date: July 27, 2023
    Applicant: SUNSHINE LAKE PHARMA CO., LTD.
    Inventors: Chao CHEN, Junji DONG, Tingting YU, Yi ZENG, Le XU, Xufang WANG, Zhiguang LI, Shaoyan LI, Qunrui YE, Xiaofeng CHEN, Wenjia LI
  • Publication number: 20230237237
    Abstract: An integrated circuit design method includes receiving an integrated circuit design, and determining a floor plan for the integrated circuit design. The floor plan includes an arrangement of a plurality of functional cells and a plurality of tap cells. Potential latchup locations in the floor plan are determined, and the arrangement of at least one of the functional cells or the tap cells is modified based on the determined potential latchup locations.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 27, 2023
    Inventors: Po-Chia Lai, Kuo-Ji Chen, Wen-Hao Chen, Wun-Jie Lin, Yu-Ti Su, Mohammed Rabiul Islam, Shu-Yi Ying, Stefan Rusu, Kuan-Te Li, David Barry Scott
  • Publication number: 20230238360
    Abstract: A semiconductor package assembly and an electronic device are provided. The semiconductor package assembly includes a base, a system-on-chip (SOC) package, a memory package and a silicon capacitor die. The base has a first surface and a second surface opposite the first surface. The SOC package is disposed on the first surface of the base and includes a SOC die having pads and a redistribution layer (RDL) structure. The RDL structure is electrically connected to the SOC die by the pads. The memory package is stacked on the SOC package and includes a memory package substrate and a memory die. The memory package substrate has a top surface and a bottom surface. The memory die is electrically connected to the memory package substrate. The silicon capacitor die is disposed on and electrically connected to the second surface of the base.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 27, 2023
    Inventors: Li-Huan CHU, Kai-Che CHENG, Ming-Tsung LIN, Sheng-Feng LIU, Chi-Ko YU
  • Publication number: 20230237842
    Abstract: A device occupation method includes a first device that obtains information related to the first device or information related to a second device, where the second device occupies a first to-be-occupied device, and the first device prepares to occupy the first to-be-occupied device, and occupying, by the first device, the first to-be-occupied device when the information matches.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Inventors: Guowen Gao, Hao Liu, Guoqi Li, Wei Wang
  • Publication number: 20230234851
    Abstract: A boron-sulfur-codoped porous carbon material and a preparation method is disclosed. The boron-sulfur-codoped porous carbon material includes a porous carbon, and B and S doped in the surface and pores of the porous carbon; where B has a doping content of 5.56 wt.% to 7.85 wt.%, and S has a doping content of 0.90 wt.% to 1.55 wt.%. Test results of examples show that the boron-sulfur-codoped porous carbon material has high doping contents of B and S, and abundant pores; in a three-electrode system, the material shows a maximum specific capacitance of 168 F·g- 1 to 290.7 F·g-1 at 0.5 A·g-1; after the material is assembled into a symmetrical supercapacitor, the supercapacitor has an ultra-high energy density of 11.3 Wh·kg-1 to 16.65 Wh·kg-1 in a neutral electrolyte system, and has a capacitance retention rate of 97.09% to 100.67% after 10,000 life tests.
    Type: Application
    Filed: August 23, 2022
    Publication date: July 27, 2023
    Applicant: Northwest Minzu University
    Inventors: Qiong SU, Yanbin WANG, Zhaoxia LI, Dian WANG, Shaofeng PANG, Shuhe KANG, Xiangfei ZHAO, Shuai WEI, Xiaoting XI, Yu TIAN, Qing WANG, Qi CHEN, Zhongxu WANG, Lichun LIANG, Lihui KANG, Shijun CAO
  • Publication number: 20230233665
    Abstract: The present invention relates to the anti-SARS-CoV-2-infection protein and vaccine, and belongs to the field of medicine. Due to the lack of efficient drugs for SARS-CoV-2 infection prevention and treatment in the prior art, the present invention provides an anti-SARS-CoV-2-infection protein, which contains a domain that binds with the angiotensin-converting enzyme 2 (ACE2) receptor as contained in the SARS-CoV-2 S protein. One the other hand, the present invention also provides a vaccine for SARS-CoV-2 infection prevention and/or treatment, which comprises the anti-SARS-CoV-2-infection protein as well as the pharmaceutically acceptable excipient or auxiliary ingredient. The present invention mainly induces the production of antibodies in the body for immunoreaction and blocks the binding the SARS-CoV-2 S protein and the ACE2 receptor of the host cell, thus helping the host to fight against the corona virus infection.
    Type: Application
    Filed: September 18, 2020
    Publication date: July 27, 2023
    Inventors: Xiawei WEI, Guangwen LU, Wei WANG, Jinliang YANG, Li YANG, Jiong LI, Jingyun YANG, Yuquan WEI, Zhenling WANG, Zhiwei ZHAO, Guobo SHEN
  • Publication number: 20230238706
    Abstract: An onboard antenna, a radio equipment and an electronic device. The onboard antenna includes a dielectric substrate, an antenna and a metal block, wherein the antenna is located on the dielectric substrate, a projection of the metal block on a plane where the dielectric substrate is located is not overlapped with a projection of the antenna on the plane where the dielectric substrate is located, the metal block is located on the dielectric substrate in a polarization direction of the antenna, and a distance between a metal edge of the metal block on a side close to the antenna and the antenna is greater than a coupling threshold. Using this onboard antenna, an influence of surface waves on the pattern can be suppressed to a certain extent by arranging the metal block, and a jitter of the antenna pattern can be reduced.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 27, 2023
    Applicant: CALTERAH SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO., LTD
    Inventors: Xuejuan HUANG, Dian WANG, Shan LI, Zhefan CHEN, Kaijie ZHUANG
  • Publication number: 20230237959
    Abstract: The present disclosure relates to a drive circuit, including: a first module, generating display data based on image information; a second module, generating a display signal based on the display data and a plurality of clock signals; a third module, outputting a constant current based on the display signal; and a fourth module, configured to provide a reference current to the third module, wherein the fourth module includes: a reference voltage generation module, a bias module, a current generation module, and a pre-charging module. Any two adjacent clock signals of the plurality of clock signals differ by M complete clock cycles, where 0?M<1. This circuit can realize relatively high image display accuracy with relatively low system power consumption and chip cost, and meanwhile realize effective low grayscale compensation for image.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 27, 2023
    Inventors: Yongsheng Tang, Li Huang, Shixiong Lu
  • Publication number: 20230239193
    Abstract: A method, wireless device and network node for multiplexing demodulation reference signals, DMRS, during short transmission time intervals, sTTIs. According to one aspect, a method includes generating an indication of an interleaved frequency division multiple access, IFDMA, subcarrier configuration for DMRS transmission. The method further includes transmitting to the wireless device the indication of IFDMA subcarrier configuration.
    Type: Application
    Filed: March 29, 2023
    Publication date: July 27, 2023
    Inventors: Florent MUNIER, Jingya LI
  • Publication number: 20230237645
    Abstract: The present disclosure discloses an Internet of Things (IoT) system for industrial data processing, a control method, and a storage medium, and provides a technical solution for a timely adjustment of production line parameters according to image information generated during a machine vision data collection on the production line. Through a difference of the image information corresponding to different process operations, a processing situation of different process operations may be obtained, so that more accurate adjustment of the production line parameter may be achieved without increasing the system complexity, thereby effectively reducing a development cost of the IoT, and increasing accuracy of the intelligent manufacturing control.
    Type: Application
    Filed: March 15, 2023
    Publication date: July 27, 2023
    Applicant: CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.
    Inventors: Zehua SHAO, Bin LIU, Lei ZHANG, Yong LI, Xiaojun WEI
  • Publication number: 20230234835
    Abstract: Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.
    Type: Application
    Filed: January 24, 2023
    Publication date: July 27, 2023
    Applicant: Analog Devices, Inc.
    Inventors: Xin Zhang, Jianglong Zhang, Li Chen, John C. Cowles, Michael Judy, Shafi Saiyed
  • Publication number: 20230238565
    Abstract: An electrochemical device including an electrode assembly including a first section, a first bend section, a second section, and a second bend section connected in sequence along a winding direction. A first bonding piece includes a first body portion disposed on the first bend section and a first extension portion disposed on the first section. The first body portion is configured to bond the first bend section to the housing. A second bonding piece includes a second body portion disposed on the second bend section and a second extension portion disposed on the first section. The second body portion is configured to bond the second bend section to the housing. A third bonding piece is disposed between the electrode assembly and the housing. The third bonding piece is bonded to the housing, the first extension portion, and the second extension portion.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: Ningde Amperex Technology Limited
    Inventor: Xuecheng LI
  • Publication number: 20230239040
    Abstract: A satellite-based communication method includes obtaining operation information of a first satellite and location information of a target coverage area; and determining parameters of an antenna of the first satellite according to the operation information of the first satellite and the location information of the target coverage area. The parameters are configured to control the antenna to provide beams directed to the target coverage area. A satellite-based communication apparatus and storage medium are also disclosed.
    Type: Application
    Filed: July 3, 2020
    Publication date: July 27, 2023
    Inventor: Yuanyuan LI
  • Publication number: 20230239982
    Abstract: An optical source switching apparatus including first optical sources, an optical cross-connect device, second optical sources, and a first coupler. The optical cross-connect device is connected to the first optical sources and the first coupler, and the first coupler is connected to the second optical source; both the first optical source and the second optical source are configured to output continuous optical energy, and the optical cross-connect device is configured to enable optical energy output by at least one of the first optical sources to enter the first coupler when at least one of the second optical sources fails; and the first coupler is configured to implement beam splitting of the optical energy output by the first optical source or the second optical source.
    Type: Application
    Filed: March 22, 2023
    Publication date: July 27, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Benbo XU, Yanbo LI, Zhen DONG
  • Publication number: 20230238402
    Abstract: A display device includes a base layer including a display area and a non-display area, a pixel circuit layer disposed on a front surface of the base layer and including a driving transistor and a switch transistor, and an antistatic circuit layer disposed on a rear surface of the base layer and including at least one electrostatic diode.
    Type: Application
    Filed: June 9, 2021
    Publication date: July 27, 2023
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kang Young LEE, Chang Il TAE, Xinxing LI
  • Publication number: 20230237630
    Abstract: This disclosure relates to image processing method and apparatus. The method includes: processing, with a first generator in an image processing model, a first sample image in a first sample set to obtain a first predicted image; processing, with the first generator, a second sample image in a second sample set to obtain a second predicted image; and training the image processing model according to a difference between the target avatar in the first sample image and the first predicted avatar and a difference between a first type attribute of the sample avatar in the second sample image and a first type attribute of the second predicted avatar.
    Type: Application
    Filed: March 31, 2023
    Publication date: July 27, 2023
    Applicant: Tencent Cloud Computing (Beijing) Co., Ltd.
    Inventors: Feida ZHU, Ying TAI, Chengjie WANG, Jilin LI
  • Publication number: 20230239882
    Abstract: Methods, systems, and devices for wireless communications are described. A target user equipment (UE) may communicate (e.g., transmit, receive) a message indicating a relay UE for relaying wireless communications between the target UE and a base station. The relay UE is selected from a set of candidate relay UEs based on existing sidelink relay communication links at the relay UE, candidate target UEs associated with the relay UE, existing communication sidelinks between the target UE and the candidate relay UEs, or any combination thereof. The target UE may receive a first control signal indicating a sidelink relay communication link for communicating messages between the first UE and the base station via the relay UE, and receive a second control signal activating the sidelink relay communication link. The target UE may then communicate a message to or from the base station via the relay UE and the sidelink relay communication link.
    Type: Application
    Filed: January 26, 2022
    Publication date: July 27, 2023
    Inventors: Jelena Damnjanovic, Junyi Li, Hua Wang, Sony Akkarakaran, Tao Luo
  • Publication number: 20230238249
    Abstract: In the method for manufacturing a semiconductor structure, a film structure is formed on a substrate, a pattern transfer layer is formed on the film structure, a plurality of holes are defined on the pattern transfer layer, and the pattern transfer layer is flattened; the film structure is etched through the holes to form capacitor holes in the film structure.
    Type: Application
    Filed: June 30, 2021
    Publication date: July 27, 2023
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Bo SHAO, Xinran LIU, Chunyang WANG, Yule SUN, Zhenxing LI