Patents by Inventor Li-Anne Liew
Li-Anne Liew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230332841Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.Type: ApplicationFiled: March 7, 2023Publication date: October 19, 2023Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
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Patent number: 11598594Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.Type: GrantFiled: May 12, 2020Date of Patent: March 7, 2023Assignee: THE REGENTS OF THE UNIVERSITY OF COLORADOInventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20220155025Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.Type: ApplicationFiled: February 3, 2022Publication date: May 19, 2022Inventors: Ryan John Lewis, Yung-Cheng Lee, Li-Anne Liew, Yunda Wang
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Publication number: 20200300563Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.Type: ApplicationFiled: May 12, 2020Publication date: September 24, 2020Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
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Patent number: 10731925Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.Type: GrantFiled: September 17, 2015Date of Patent: August 4, 2020Assignee: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATEInventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20190390919Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.Type: ApplicationFiled: August 13, 2019Publication date: December 26, 2019Inventors: Ryan John Lewis, Yung-Cheng Lee, Li-Anne Liew, Yunda Wang
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Patent number: 9921004Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.Type: GrantFiled: October 28, 2015Date of Patent: March 20, 2018Assignee: KELVIN THERMAL TECHNOLOGIES, INC.Inventors: Ryan John Lewis, Yung-Cheng Lee, Li-Anne Liew, Yunda Wang
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Publication number: 20160161193Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.Type: ApplicationFiled: October 28, 2015Publication date: June 9, 2016Inventors: Ryan John Lewis, Yung-Cheng Lee, Li-Anne Liew, Yunda Wang
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Publication number: 20160076820Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.Type: ApplicationFiled: September 17, 2015Publication date: March 17, 2016Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20160081227Abstract: Embodiments described in this disclosure include a heat spreader. The heat spreader may include a first layer having a thickness less than about 300 microns; a plurality of pillars disposed on the first layer and arrayed in a pattern, wherein each of the plurality of pillars have a height of less than 100 microns; a second layer having a thickness of less than 200 microns, wherein a portion of the first layer and a portion of the second layer are sealed together; and a vacuum chamber formed between the first layer and the second layer and within which the plurality of pillars are disposed.Type: ApplicationFiled: September 14, 2015Publication date: March 17, 2016Inventors: Yung-Cheng Lee, Shanshan Xu, Ronggui Yang, Collin Jennings Coolidge, Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin
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Publication number: 20050007118Abstract: A method of fabricating compact alkali vapor filled cells that have volumes of 1 cm3 or less that are useful in atomic frequency reference devices such as atomic clocks. According to one embodiment the alkali vapor filled cells are formed by sealing the ends of small hollow glass fibers. According to another embodiment the alkali vapor filled cells are formed by anodic bonding of glass plates to silicon wafers to seal the openings of holes formed in the silicon wafers. The anodic bonding method of fabricating the alkali vapor filled cells enables the production of semi-monolithic integrated physics packages of various designs.Type: ApplicationFiled: April 8, 2004Publication date: January 13, 2005Inventors: John Kitching, Leo Hollberg, Li-Anne Liew, Svenja Knappe, John Moreland, Volodja Velichanski, Hugh Robinson
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Publication number: 20030085214Abstract: A ceramic micro-glow plug made from three primary constituents, silicon, carbon and nitrogen by forming a precursor liquid polymer in a mold or by photolithograpy, drying, pyrolizing and annealing. A U-shaped design with two arms joined at thin tip, and the composition of the silicon carbon-nitride ceramic allow the tip to reach a high operating temperature with a minimum power applied across the electrical contacts. When the tip is at the highest operating temperature, the remainder of the structure remains relatively cool. In an embodiment, an additional component such as boron is added to the silicon carbon-nitride to increase the electrical conductivity of the micro-glow plug. In another embodiment, a plurality of micro-glow plugs are attached to a body wherein when the operational micro-glow plug fails, the next successive micro-glow plug receives power across its electrical contacts.Type: ApplicationFiled: November 7, 2001Publication date: May 8, 2003Applicant: University of Colorado At BoulderInventors: Li-Anne Liew, Rishi Raj