Patents by Inventor Li Bo

Li Bo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260203924
    Abstract: To enable appropriate measurement of a body shape size of a user for each purpose. An information processing device according to the present application includes an acquisition unit and a learning unit. The acquisition unit acquires, from a three-dimensional model of the user, information indicating a range of a length measurement target and data of a length of a line segment of the measurement target, the data being of a length according to a purpose and used for a predetermined purpose. The learning unit causes learning of the estimation model that estimates the length of the line segment of the measurement target used for the purpose from the three-dimensional model such that the length of the line segment estimated from the three-dimensional model becomes an actual measurement value of the length of the line segment of the measurement target.
    Type: Application
    Filed: December 14, 2023
    Publication date: July 16, 2026
    Inventors: Takayasu YAMADA, Kengo ONO, Eri KOJIMA, Li BO
  • Patent number: 12511825
    Abstract: An information processing device includes: a formation unit configured to analyze relative positions of dots as measurement markers that expand and contract together with a suit, and form a cluster of the dots; an assignment unit configured to assign numbers to the cluster and the dots; a specification unit configured to acquire the assigned number, set the assigned number to a predetermined coordinate position, and specify a silhouette; and a generation unit configured to generate a three-dimensional (3D) model based on the specified silhouette. The formation unit forms a hexagonal cluster from a dot pattern of the suit, and increases the hexagonal cluster to form a unique honeycomb structure. The assignment unit assigns numbers to the cluster and the dots based on the honeycomb structure. Solid dots and hollow dots are printed as the dots on the whole suit. Thus, a 3D model of a body shape of a user is created with higher accuracy by using a garment for measuring body sizes.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: December 30, 2025
    Assignee: ZOZO, Inc.
    Inventors: Masahiro Ito, Goffinet Francois, Heather Jamie, Li Bo, Gardner Jim, Villamarin Rigo
  • Publication number: 20240153204
    Abstract: An information processing device includes: a formation unit configured to analyze relative positions of dots as measurement markers that expand and contract together with a suit, and form a cluster of the dots; an assignment unit configured to assign numbers to the cluster and the dots; a specification unit configured to acquire the assigned number, set the assigned number to a predetermined coordinate position, and specify a silhouette; and a generation unit configured to generate a three-dimensional (3D) model based on the specified silhouette. The formation unit forms a hexagonal cluster from a dot pattern of the suit, and increases the hexagonal cluster to form a unique honeycomb structure. The assignment unit assigns numbers to the cluster and the dots based on the honeycomb structure. Solid dots and hollow dots are printed as the dots on the whole suit. Thus, a 3D model of a body shape of a user is created with higher accuracy by using a garment for measuring body sizes.
    Type: Application
    Filed: March 9, 2021
    Publication date: May 9, 2024
    Inventors: Masahiro ITO, Goffinet FRANCOIS, Heather JAMIE, Li BO, Gardner JIM, Villamarin RIGO
  • Publication number: 20110101789
    Abstract: Provided is an RF power harvesting circuit with improved sensitivity to RF energy. The RF power harvesting device includes an inductor, a first capacitor connected to the inductor, a first MOSFET connected to a first node, and a second MOSFET connected to the first node. The inductor or the first capacitor are connected to the first node.
    Type: Application
    Filed: December 1, 2009
    Publication date: May 5, 2011
    Inventors: Thomas Steven Salter, JR., George M. Metze, Neil Goldsman, Kwangsik Choi, Yves Ngu, Zeynep Dilli, Martin Peckerar, Li Bo