Patents by Inventor Li C. Tai

Li C. Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for low profile die package
    Patent number: 8211748
    Abstract: A semiconductor integrated circuit (IC) device is defined by a low-profile package without a die attach pad (DAP). In place of the DAP, an adhesive element is used to retain a die relative to a lead frame during processing. In one example, a method of manufacturing the device includes sealing the lead frame on one side using an adhesive tape and exposing a portion of the tape within a die attach region. The die is secured onto the tape adhesive and held in place during subsequent processing, such as a wire bonding procedure to couple the die to external portions of the frame.
    Type: Grant
    Filed: August 28, 2006
    Date of Patent: July 3, 2012
    Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Hun K. Lee, Sai M. Lee, Li C. Tai
  • Systems and methods for low profile die package
    Publication number: 20080048302
    Abstract: A semiconductor integrated circuit (IC) device is defined by a low-profile package without a die attach pad (DAP). In place of the DAP, an adhesive element is used to retain a die relative to a lead frame during processing. In one example, a method of manufacturing the device includes sealing the lead frame on one side using an adhesive tape and exposing a portion of the tape within a die attach region. The die is secured onto the tape adhesive and held in place during subsequent processing, such as a wire bonding procedure to couple the die to external portions of the frame.
    Type: Application
    Filed: August 28, 2006
    Publication date: February 28, 2008
    Inventors: Hun K. Lee, Sai M. Lee, Li C. Tai