Patents by Inventor Li Chan YAN

Li Chan YAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230187800
    Abstract: Some embodiments of the disclosure provide an isolator which includes a body, a first circuit module, and a second circuit module. In some examples, the first circuit module is arranged at a first connecting port of the body and includes a first integrated circuit board, a first shell surrounding the first integrated circuit board, a first signal processing circuit penetrating through the first integrated circuit board, and a joint sleeved on an insulating bushing. The joint partially surrounds the first signal processing circuit. A first end portion of the first signal processing circuit is electrically connected to a first contact element. The second circuit module is arranged at a second connecting port of the body and includes a second integrated circuit board, a second shell surrounding the second integrated circuit board, and a second signal processing circuit extending along a length direction of the second integrated circuit board.
    Type: Application
    Filed: December 15, 2022
    Publication date: June 15, 2023
    Applicant: EZCONN CORPORATION
    Inventors: Li Chan YAN, Ming-Ching CHEN