Abstract: A method of forming a metal coating comprising the steps of: (a) generating an arc at a metal target to create metal ions in a chamber that is under vacuum or has an inert atmosphere; (b) depositing the metal ions on a substrate to form a metal layer thereon; and (c) controlling an amount of gas in the chamber to form a primary metal-gas compound layer on said metal layer and a secondary metal-gas compound layer on said primary metal-gas compound layer, wherein said primary and secondary metal-gas compound layers have different gas atom contents.

Abstract: Coatings are deposited using arc-based deposition methods using a large negative bias on the substrate, of ?1,500 V or more negative, which is varied during deposition, resulting in reduced stress in the coating.

Abstract: A method and apparatus for providing a substrate coating having a predetermined resistivity is described. The method comprises the steps of providing a substrate to be coated in a vacuum chamber, creating a plasma in the chamber, and depositing ions of the plasma on the substrate to form a ta-C substrate coating. The coating “step is stopped when the ta-C substrate coating has the predetermined resistivity. The predetermined resistivity is 105-1010 ?cm, and preferably about 106 ?cm. The substrate may be biased during the method to aid in arriving at the predetermined resistivity. The coating may be employed to reduce the risk of, or prevent electrostatic discharge to or from the substrate, or to provide a seed layer to improve adhesion between the substrate a further coating. Also described are coatings having predetermined resistivities.

Abstract: Methods and apparatus for removing material from a substrate, such as an IC component, are disclosed. The methods include creating a plasma in an evacuatable chamber, by providing a power source to an electrode in the chamber, and contacting the substrate surface with at least one of ions, atoms and free radicals of the plasma. The power source, preferably DC, is supplied to the electrode as a variable, and preferably a pulsed voltage to prevent arcing.

Abstract: An arc deposition apparatus comprises an evacuatable chamber and means for positioning at least two targets in the chamber, wherein a first one of the at least two targets is positionable in an operative position and another of the at least two targets is positionable in a standby position. An electrical power supply is provided for supplying electrical power to the target held in the operative position to form an arc on an emission surface of the operative target. Means are provided for preparing an emission surface of the target positioned in the standby position to have a predetermined morphology. Alternatively, or in conjunction with the surface preparing means, means are provided for inspecting whether the emission surface of the target positioned in the standby position has a predetermined morphology. Preferably, the positioning means is configured to interchange the at least two targets at a predetermined time.

Abstract: Coatings are deposited using arc-based deposition methods using a large negative bias on the substrate, of ?1,500 V or more negative, which is varied during deposition, resulting in reduced stress in the coating.