Patents by Inventor Li-Chen Hsieh

Li-Chen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220080452
    Abstract: Disclosed herein is a method for applying a liquid metal on a surface of an object that is selected from the group consisting of a heat-emitting surface and a heat-conducting surface. The method includes applying the liquid metal onto the surface, and applying a force to the liquid metal using a tool to destroy cohesion of the liquid metal, followed by moving the tool back and forth to apply the liquid metal on the surface.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 17, 2022
    Inventors: Li-Chen HSIEH, Chiu-Lang LIN
  • Publication number: 20170176113
    Abstract: A heat sink adapted to dissipate heat from a heat source includes a heat dissipating unit that includes at least one deformation portion protruding toward the heat source, and a reflective surface formed on the deformation portion and facing the heat source for reflecting radiant heat from the heat source. A case including the heat sink is also disclosed.
    Type: Application
    Filed: July 7, 2016
    Publication date: June 22, 2017
    Inventors: Chiu-Lang Lin, Li-Chen Hsieh
  • Publication number: 20130035615
    Abstract: The present invention discloses an instant-suction pressure-adjustable cupping device and a cupping therapy method using the same.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventor: Lisa Li-Chen HSIEH