Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: An electrochemical catalyst electrode to increase bonding durability between covering layers and a metal substrate is made by processing a metal substrate at a high temperature and etching the metal substrate to form a large number of etching pores on granular surfaces; heating the metal substrate to transform the surface thereof to an oxygen interstitial layer; laminating an inner covering layer which is compatible to the oxygen interstitial layer on the metal substrate and deeply planted into the pores to form included angles to increase adhering force between the inner covering layer and the substrate and to reduce peeling on the interface; and forming an outer covering layer on the layers with stabilizing additive added in the outer covering layer to enhance the stability of the outer surface of the covering layers thereby to reduce dissolution of noble metal; and greatly increase stability and durability of the electrode.