Abstract: A method and system for evaluation of object motion repetitiveness as a basis to distinguish between human motion and non-human motion, in order to facilitate control of device operation. An example method includes (i) a computing system receiving sensor data representing object motion detected by at least one sensor, the object motion defining motion of an object, (ii) the computing system making a determination, based at least on an evaluation of the received sensor data, of whether the detected object motion is repetitive, and (iii) based at least on the determination being that the detected object motion is not repetitive, the computing system responding to the detected object motion by causing a device to take an action corresponding with a prediction that the object is a human being.

Abstract: A method for forming a bump on under bump metallurgy according to the present invention is provided. A bonding pad is first formed on the active surface of a wafer. Subsequently, a passivation layer is formed on the active surface of the wafer and exposes the bonding pad. An under bump metallurgy is formed on the bonding pad. A layer of film is formed on the passivation layer and overlays the under bump metallurgy. Afterward, the portion of the film on the under bump metallurgy is exposed to a UV light and the exposed portion of the film is removed to expose the under bump metallurgy. A solder paste is applied to the under bump metallurgy and the remaining film on the wafer is removed. Finally, the solder paste is reflowed to form a spherical bump.

Abstract: A first dielectric layer is formed on a mold having a surface and protruding components and covers the protruding components. At least one electronic component having an active surface, a back surface, and contacts formed on the active surface is disposed on the first dielectric layer. The active surface is faced to the first dielectric layer, and the contacts are corresponding to the protruding components. A second dielectric layer is formed on the first dielectric layer and a carrier is disposed on the back surface of the electronic component. Openings located corresponding to the contacts are further formed within the first dielectric layer by the protruding components in an imprinting step, such that when the mold is removed, the contacts are exposed from the openings.

Abstract: A bumping process and a structure thereof are provided. The bumping process includes the following steps. Firstly, a wafer having a number of pads is provided. Next, a UBM layer is formed on the pad. Then, a conductive first photo-resist layer is coated on the wafer to cover the UBM layer. Next, a second photo-resist layer is coated on the first photo-resist layer. Then, at least a portion of the second photo-resist layer is removed to form an opening above the UBM layer. The first photo-resist layer maintains electric connection with the UBM layer. Next, a solder layer is formed in the opening by electroplating process. Then, the first photo-resist layer and the second photo-resist layer are removed expect the portion of the first photo-resist layer under the solder layer.

Abstract: A method for forming bumps is disclosed. First, a substrate having a surface and an under bump metallurgy layer formed thereon is provided, and a portion of the under bump metallurgy layer is removed thereafter. Next, a mask having a metal layer thereon is disposed over the surface of substrate, in which the mask includes at least one opening for exposing the under bump metallurgy layer. Subsequently, a metal is disposed in the opening and the mask having the metal layer is removed.

Abstract: A method for caching of stream data is accomplished by assigning for each video segment in the system a likelihood rating of future showing and then determining for each node that contains a copy of the segment a second likelihood value that reflecting a probability that the node will be used to serve streams for the segment. The future cost value of a segment copy is then predicted and preload orders are issued to nodes for segments with the per-copy likelihood above a predefined threshold.

Abstract: A wafer structure including a semiconductor substrate, a number of UBM layers and a number of bumps is provided. The semiconductor substrate has an active surface, a number of bonding pads and a passivation layer. The bonding pads are positioned on the active surface of the semiconductor substrate. The passivation layer covers the active surface of the semiconductor substrate and exposes the bonding pads. The UBM layers are respectively arranged on the bonding pads, and each UBM layer includes an adhesive layer, a super-lattice barrier layer and a wetting layer. The adhesion layer is disposed on bonding pads. The super-lattice barrier layer is disposed on the adhesion layer and includes a number of alternately stacked sub-barrier layers and sub-wetting layers. The wetting layer is disposed on the super-lattice barrier layer, and the bump is disposed on the wetting layer.

Abstract: A method for forming a bump on under bump metallurgy according to the present invention is provided. A bonding pad is first formed on the active surface of a wafer. Subsequently, a passivation layer is formed on the active surface of the wafer and exposes the bonding pad. An under bump metallurgy is formed on the bonding pad. A layer of film is formed on the passivation layer and overlays the under bump metallurgy. Afterward, the portion of the film on the under bump metallurgy is exposed to a UV light and the exposed portion of the film is removed to expose the under bump metallurgy. A solder paste is applied to the under bump metallurgy and the remaining film on the wafer is removed. Finally, the solder paste is reflowed to form a spherical bump.

Abstract: A system for live TV transmission over IP networks incorporates a content encoder receiving live TV broadcast and converting to RTP packets for multicast streaming. A streaming server receives the multicast RTP packets from the content encoder and converts the multicast stream to a unicast stream. The streaming server is also responsive to RTSP commands for trick mode operation. A settop box is connected through an IP network for receiving multicast RTP packets from the content encoder and generating RTSP commands for trick mode operation, the setup box issuing a leave multicast group signal upon issuing a trick mode command and receiving unicast transmission of RTP packets from the streaming server controllable by the trick mode commands.

Abstract: A substrate process for an embedded component is disclosed. A mold having a surface and protruding components protruded from the surface is provided. A first dielectric layer is formed on the surface and covers the protruding components. At least one electronic component having an active surface, a back surface, and contacts formed on the active surface is disposed on the first dielectric layer. The active surface is faced to the first dielectric layer, and the contacts are corresponding to the protruding components. A second dielectric layer is formed on the first dielectric layer and a carrier is disposed on the back surface of the electronic component. Openings are formed on the first dielectric layer by the protruding components in an imprinting step. The openings are corresponding to the contacts. Finally, the mold is removed to form a substrate with an embedded component.

Abstract: A flip chip package including a chip structure, a substrate and an under-fill is provided. The chip structure includes a base, a number of pads, a first passivation layer, a second passivation layer and a number of bumps. The pads are formed on the base. The first passivation layer is formed on the base and exposes the pads. The second passivation layer formed on the first passivation layer has a number of first openings and at least a second openings. The first openings are positioned on the pads. The second openings are positioned on the area other than the pads. The width at the bottom of the second opening is larger than the width of the second opening at the top. The bumps are formed on the pads. The substrate has a number of connecting points corresponding to the bumps.

Abstract: A chip structure and a manufacturing method of the same. The chip structure includes a base, a pad, a first passivation layer, a second passivation layer and a bump. The pad is formed on the base. The first passivation layer is formed on the base exposing the pad. The second passivation layer formed on the first passivation layer has a passivation layer opening which is positioned above the pad. The bump is formed on the pad, and a part of the bump is disposed inside the passivation layer opening. The width at the bottom of the passivation layer opening is larger than the width at the top of the passivation layer opening, such that the bump is firmly fixed by the second protection layer.

Abstract: A system for live TV transmission over IP networks incorporates a content encoder receiving live TV broadcast and converting to RTP packets for multicast streaming. A streaming server receives the multicast RTP packets from the content encoder and converts the multicast stream to a unicast stream. The streaming server is also responsive to RTSP commands for trick mode operation. A settop box is connected through an IP network for receiving multicast RTP packets from the content encoder and generating RTSP commands for trick mode operation, the setup box issuing a leave multicast group signal upon issuing a trick mode command and receiving unicast transmission of RTP packets from the streaming server controllable by the trick mode commands.

Abstract: A method for forming bumps is disclosed. First, a substrate having a surface and an under bump metallurgy layer formed thereon is provided, and a portion of the under bump metallurgy layer is removed thereafter. Next, a mask having a metal layer thereon is disposed over the surface of substrate, in which the mask includes at least one opening for exposing the under bump metallurgy layer. Subsequently, a metal is disposed in the opening and the mask having the metal layer is removed.

Abstract: A bumping process and a structure thereof are provided. The bumping process includes the following steps. Firstly, a wafer having a number of pads is provided. Next, a UBM layer is formed on the pad. Then, a conductive first photo-resist layer is coated on the wafer to cover the UBM layer. Next, a second photo-resist layer is coated on the first photo-resist layer. Then, at least a portion of the second photo-resist layer is removed to form an opening above the UBM layer. The first photo-resist layer maintains electric connection with the UBM layer. Next, a solder layer is formed in the opening by electroplating process. Then, the first photo-resist layer and the second photo-resist layer are removed expect the portion of the first photo-resist layer under the solder layer.

Abstract: A wafer structure including a semiconductor substrate, a number of UBM layers and a number of bumps is provided. The semiconductor substrate has an active surface, a number of bonding pads and a passivation layer. The bonding pads are positioned on the active surface of the semiconductor substrate. The passivation layer covers the active surface of the semiconductor substrate and exposes the bonding pads. The UBM layers are respectively arranged on the bonding pads, and each UBM layer includes an adhesive layer, a super-lattice barrier layer and a wetting layer. The adhesion layer is disposed on bonding pads. The super-lattice barrier layer is disposed on the adhesion layer and includes a number of alternately stacked sub-barrier layers and sub-wetting layers. The wetting layer is disposed on the super-lattice barrier layer, and the bump is disposed on the wetting layer.

Abstract: Methods and apparatus are disclosed for automatically selecting a video output from among several video input sources. In one method, one or more audio sensors are associated with each video input source. Preferably, an audio sensor is positioned to receive audio signals from directions that receive favorable coverage in the field of view of the associated video source. An autoselector calculates audio scores for each of the audio sensors over short (e.g., 0.5 seconds) examination intervals. At each examination interval, the potential exists for a different video source to be selected as the video output. The autoselector selects a video source based on the audio scores for an examination interval, as well as the recent time-history of video source selection. For instance, if a new video source has just been selected, selection of a different source may be disabled for a few seconds. The time-history is also used to increase the probability that source selection varies in a seemingly-natural manner.

Abstract: A method and apparatus to support a first peer node receiving an inquiry for data from a second peer node. In one embodiment, the first peer node transcodes the data before transmitting the data to the second peer node, wherein the transcoding includes converting the data into a format that can be processed by the second peer node, and transmitting the data to the second peer node in a transport specification as requested by the second peer node.

Abstract: Methods and apparatus are disclosed for automatically selecting a video output from among several video input sources. In one method, one or more audio sensors are associated with each video input source. Preferably, an audio sensor is positioned to receive audio signals from directions that receive favorable coverage in the field of view of the associated video source. An autoselector calculates audio scores for each of the audio sensors over short (e.g., 0.5 seconds) examination intervals. At each examination interval, the potential exists for a different video source to be selected as the video output. The autoselector selects a video source based on the audio scores for an examination interval, as well as the recent time-history of video source selection. For instance, if a new video source has just been selected, selection of a different source may be disabled for a few seconds. The time-history is also used to increase the probability that source selection varies in a seemingly-natural manner.