Abstract: A method includes forming a transistor over a substrate; forming a front-side interconnection structure over the transistor; after forming the front-side interconnection structure, removing the substrate; after removing the substrate, forming a backside via to be electrically connected to the transistor; depositing a dielectric layer to cover the backside via; forming an opening in the dielectric layer to expose the backside via; forming a spacer structure on a sidewall of the opening; after forming a spacer structure, forming a conductive feature in the opening to be electrically connected to the backside via; and after forming the conductive feature, forming an air gap in the spacer structure.

Abstract: The present disclosure describes a method to form a backside power rail (BPR) semiconductor device with an air gap. The method includes forming a fin structure on a first side of a substrate, forming a source/drain (S/D) region adjacent to the fin structure, forming a first S/D contact structure on the first side of the substrate and in contact with the S/D region, and forming a capping structure on the first S/D contact structure. The method further includes removing a portion of the first S/D contact structure through the capping structure to form an air gap and forming a second S/D contact structure on a second side of the substrate and in contact with the S/D region. The second side is opposite to the first side.

Abstract: A method for manufacturing an electronic device is provided. The method includes the following steps: providing a first sub-substrate; providing a second sub-substrate; forming an organic layer between the first sub-substrate and the second sub-substrate, wherein the first sub-substrate and the second sub-substrate are fixed by the organic layer to form a protective substrate; performing a polishing process on a side surface of the protective substrate so that a surface roughness of the side surface is greater than or equal to 1 micrometer and less than or equal to 15 micrometers; and adhering the protective substrate to a frame.

Abstract: A semiconductor device structure includes a source/drain feature comprising a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface. The structure also includes a dielectric layer having a continuous surface in contact with the entire second surface of the source/drain feature, a semiconductor layer having a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface, wherein the sidewall of the semiconductor layer is in contact with the sidewall of the source/drain feature. The structure also includes a gate dielectric layer in contact with the continuous surface of the dielectric layer and the second surface of the semiconductor layer, and a gate electrode layer surrounding a portion of the semiconductor layer.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a device, a first dielectric material disposed over the device, and an opening is formed in the first dielectric material. The semiconductor device structure further includes a conductive structure disposed in the opening, and the conductive structure includes a first sidewall. The semiconductor device structure further includes a surrounding structure disposed in the opening, and the surrounding structure surrounds the first sidewall of the conductive structure. The surrounding structure includes a first spacer layer and a second spacer layer adjacent the first spacer layer. The first spacer layer is separated from the second spacer layer by an air gap.

Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a substrate. A gate electrode is over the substrate and a spacer structure laterally surrounds the gate electrode. A conductive via is disposed on the gate electrode. A liner is arranged along one or more sidewalls of the spacer structure. The conductive via has a bottommost surface that has a larger width than a part of the conductive via that is laterally adjacent to one or more interior sidewalls of the liner.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first insulating layer over a substrate. A first metal feature is formed in the first insulating layer and a second insulating layer is formed over the first insulating layer. A first metal via is formed through the second insulating layer to connect the first metal feature. A second metal feature is formed over the second insulating layer. The second metal feature has a convex top surface and a plane bottom surface, and the plane bottom is electrically connected to the first metal feature through the first metal via.

Abstract: A semiconductor structure includes one or more channel layers; a gate structure engaging the one or more channel layers; a first source/drain feature connected to a first side of the one or more channel layers and adjacent to the gate structure; a first dielectric cap disposed over the first source/drain feature, wherein a bottom surface of the first dielectric cap is below a top surface of the gate structure; a first via disposed under and electrically connected to the first source/drain feature; and a power rail disposed under and electrically connected to the first via.

Abstract: Semiconductor devices including air spacers formed in a backside interconnect structure and methods of forming the same are disclosed. In an embodiment, a device includes a first transistor structure; a front-side interconnect structure on a front-side of the first transistor structure; and a backside interconnect structure on a backside of the first transistor structure, the backside interconnect structure including a first dielectric layer on the backside of the first transistor structure; a first via extending through the first dielectric layer, the first via being electrically coupled to a first source/drain region of the first transistor structure; a first conductive line electrically coupled to the first via; and an air spacer adjacent the first conductive line, the first conductive line defining a first side boundary of the air spacer.

Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes a gate structure sandwiched between and in contact with a first spacer feature and a second spacer feature, a top surface of the first spacer feature and a top surface of the second spacer feature extending above a top surface of the gate structure, a gate self-aligned contact (SAC) dielectric feature over the first spacer feature and the second spacer feature, a contact etch stop layer (CESL) over the gate SAC dielectric feature, a dielectric layer over the CESL, a gate contact feature extending through the dielectric layer, the CESL, the gate SAC dielectric feature, and between the first spacer feature and the second spacer feature to be in contact with the gate structure, and a liner disposed between the first spacer feature and the gate contact feature.

Abstract: A cell measurement method used in a mobile station camping on a serving cell is provided, wherein the serving cell sends system information of neighbor cells to the mobile station. A first set of the neighbor cells is determined based on a measurement rule for cell reselection. A second set of the neighbor cells is determined based on a report request for radio link establishment. A subset is chosen from the second set. Finally, the neighbor cells of a union of the first set and the subset are measured.

Abstract: A method for controlling radio links in a cellular communication system. The method comprises: receiving an active set update message from the system controller via at least one of the first radio link and the second radio link at the first user equipment to direct the first user equipment to terminate the first radio link, determining a communication status of the first radio link according to a current quality of the first radio link and a current quality of the second radio link after receiving the active set update message, and managing the first radio link and the second radio link according to the communication status.

Abstract: A method for handling data transmission by a mobile station with a first RF module and second RF module is provided. The mobile station is coupled to a computer acquiring an IP address IP(U). A packet with a source IP address IP(U) and a destination IP address IP(Y) corresponding to an access network is received by the mobile station. The first RF module is assigned to transmit the received packet by replacing the source IP address IP(U) with a source IP address IP(A). Another packet with the source IP address IP(U) and destination IP address IP(Y) is assigned to the second RF module, and the source IP address IP(U) is replaced by a source IP address IP(B). The replaced packets are transmitted to the access network via the first and second RF module respectively.

Abstract: A system for handling packet-switched data transmission is provided. The system includes a first RF module, a second RF module, a first subscriber identity card camping on a cell via the first RF module, a second subscriber identity card camping on the same cell or a different cell via the second RF module and a load balancing unit. The load balancing unit receives an uplink IP packet, determines one subscriber identity card from the first and second subscriber identity cards when the uplink IP packet comprises information regarding an unestablished connection of a recognized application, and transmits the uplink IP packet to a destination via the determined subscriber identity card and the RF module corresponding to the determined subscriber identity card.

Abstract: The invention discloses a method for coordinating protocol stack entities to share a single radio resource, executed by a processor of a mobile station, including the step of: after a first protocol stack entity for a first subscriber identity card enters a TALKING mode or enables a dial-up service, forcing a second protocol stack entity for a second subscriber identity card to release the radio resource or suspend utilization of the radio resource, and enabling the radio resource to be utilized to perform requisite operations or procedures of the TALKING mode or the dial-up service.

Abstract: A communication apparatus has at least one radio transceiver module, a first subscriber identity card and a second subscriber identity card, where the first subscriber identity card corresponds to a first public land mobile network (PLMN), and the second subscriber identity card corresponds to a second PLMN. The communication apparatus includes processor logic determining whether the first PLMN and the second PLMN are the same, and for suspending a measurement procedure and a cell reselection procedure of one of the first subscriber identity card and the second subscriber identity card to reduce battery power consumption. Processor logic further triggers an unsuspended measurement procedure to tune the radio transceiver module to a plurality of corresponding channel frequency/frequencies of the neighbor cells.

Abstract: A communication apparatus has at least one radio transceiver module, a first subscriber identity card with a first address and a second subscriber identity card with a second address. The first subscriber identity card camps on a first cell belonging to a first wireless network via the radio transceiver module, and the second subscriber identity card camps on a second cell belonging to a second wireless network via the radio transceiver module. The communication apparatus includes first processor logic coupled to the radio transceiver module, the first subscriber identity card and the second subscriber identity card, receiving a communication request requesting for establishing wireless communication between the first subscriber identity card and a peer communication entity.

Abstract: A communication apparatus has at least one radio transceiver module, a first subscriber identity card with a first address and a second subscriber identity card with a second address. The first subscriber identity card camps on a first cell belonging to a first wireless network via the radio transceiver module, and the second subscriber identity card camps on a second cell belonging to a second wireless network via the radio transceiver module. The communication apparatus includes first processor logic coupled to the radio transceiver module, the first subscriber identity card and the second subscriber identity card, receiving a communication request requesting for establishing wireless communication between the first subscriber identity card and a peer communication entity.

Abstract: A communication apparatus has at least one radio transceiver module, a first subscriber identity card and a second subscriber identity card, where the first subscriber identity card corresponds to a first public land mobile network (PLMN), and the second subscriber identity card corresponds to a second PLMN. The communication apparatus includes processor logic determining whether the first PLMN and the second PLMN are the same, and for suspending a measurement procedure and a cell reselection procedure of one of the first subscriber identity card and the second subscriber identity card to reduce battery power consumption. Processor logic further triggers an unsuspended measurement procedure to tune the radio transceiver module to a plurality of corresponding channel frequency/frequencies of the neighbor cells.

Abstract: The invention provides a method for positioning a user equipment. First, a plurality of wireless links between the user equipment and a plurality of mobile networks are established. A plurality of first location information sets describing a location of the user equipment are then obtained from the mobile networks through the wireless links. The first location information sets are then converted to a plurality of second location information sets with a predetermined format. The second location information sets are then combined to estimate a third location information set describing the location of the user equipment.