Abstract: The invention provides a layout pattern of static random access memory (SRAM), which at least comprises a plurality of gate structures located on a substrate and spanning the plurality of fin structures to form a plurality of transistors distributed on the substrate, wherein the plurality of transistors comprise two pull-up transistors (PU), two pull-down transistors (PD) to form a latch circuit, and two access transistors (PG) connected to the latch circuit. In each SRAM memory cell, the fin structure included in the pull-up transistor (PU) is defined as a PU fin structure, the fin structure included in the pull-down transistor (PD) is defined as a PD fin structure, and the fin structure included in the access transistor (PG) is defined as a PG fin structure, wherein a width of the PD fin structure is wider than a width of the PG fin structure.

Abstract: A method includes receiving a substrate having a front side and a back side, forming a shallow trench in the substrate from the front side, forming a liner layer including a first dielectric material in the shallow trench, depositing a second dielectric material different from the first dielectric material on the liner layer to form an isolation feature in the shallow trench, forming an active region surrounded by the isolation feature, forming a gate stack on the active region, forming a source/drain (S/D) feature on the active region and on a side of the gate stack, thinning down the substrate from the back side such that the isolation feature is exposed, etching the active region to expose the S/D feature from the back side to form a backside trench, and forming a backside via feature landing on the S/D feature and surrounded by the liner layer.

Abstract: The invention provides a layout pattern of static random access memory (SRAM), which at least comprises a plurality of gate structures located on a substrate and spanning the plurality of fin structures to form a plurality of transistors distributed on the substrate, wherein the plurality of transistors comprise two pull-up transistors (PU), two pull-down transistors (PD) to form a latch circuit, and two access transistors (PG) connected to the latch circuit. In each SRAM memory cell, the fin structure included in the pull-up transistor (PU) is defined as a PU fin structure, the fin structure included in the pull-down transistor (PD) is defined as a PD fin structure, and the fin structure included in the access transistor (PG) is defined as a PG fin structure, wherein a width of the PD fin structure is wider than a width of the PG fin structure.

Abstract: Methods for chemical mechanical polishing (CMP), and methods for forming an interconnect structure of a semiconductor device are provided. The methods include performing CMP on a surface of a dielectric structure with a CMP slurry to remove a portion of a metal layer formed in the dielectric structure and having at least a first layer exposed through the surface. In some examples, the CMP slurry that includes an abrasive, an oxidizing agent, and a compound configured to reduce aggregation of the abrasive on the surface of the dielectric structure. In some examples, the compound has positively charged ions that interact with the abrasive to reduce aggregation of the abrasive on a dielectric material. In some examples, the CMP slurry includes potassium hydroxide. In some examples, the compound includes an ammonium salt.

Abstract: The invention provides carriers and kits for use in the identification of ligands. Carriers of the invention are provided to which is attached a DNA encoding a peptide and a ?2 microglobulin. Carriers of the invention are capable of identifying an epitope recognized by a T-cell receptor and/or an NK-cell receptor and/or an NKT-cell receptor. The invention also provides kits for screening for a T-cell epitope and/or an NK-cell epitope and/or an NKT-cell epitope, wherein the kits comprise a carrier of the invention.

Abstract: A carrier to which is attached a peptide and DNA encoding the peptide, wherein the peptide includes at least one non-natural amino acid and/or wherein the peptide has a constrained secondary structure; or a carrier to which is attached ?2 microglobulin, a peptide, and DNA encoding the peptide, said carrier not bearing an MHC or MHC-like molecule.

Abstract: A carrier to which is attached a peptide and DNA encoding the peptide, wherein the peptide includes at least one non-natural amino acid and/or wherein the peptide has a constrained secondary structure; or a carrier to which is attached ?2 microglobulin, a peptide, and DNA encoding the peptide, said carrier not bearing an MHC or MHC-like molecule.

Abstract: A method to identify a peptide and/or its encoding DNA, wherein the peptide binds to a T-cell receptor and/or an NK-cell receptor and/or an NKT-cell receptor, the method comprising: providing a carrier to which is attached a peptide and its encoding DNA; providing an MHC and/or an MHC-like molecule; and exposing the peptide to a T-cell receptor and/or an NK-cell receptor and/or an NKT-cell receptor in the presence of the MHC or MHC-like molecule.

Abstract: A carrier to which is attached a peptide and DNA encoding the peptide, wherein the peptide includes at least one non-natural amino acid and/or wherein the peptide has a constrained secondary structure; or a carrier to which is attached ?2 micro-globulin, a peptide, and DNA encoding the peptide, said carrier not bearing an MHC or MHC-like molecule.

Abstract: A method to identify a peptide and/or its encoding DNA, wherein the peptide binds to a T-cell receptor and/or an NK-cell receptor and/or an NKT-cell receptor, the method comprising: providing a carrier to which is attached a peptide and its encoding DNA; providing an MHC and/or an MHC-like molecule; and exposing the peptide to a T-cell receptor and/or an NK-cell receptor and/or an NKT-cell receptor in the presence of the MHC or MHC-like molecule.

Abstract: The invention, the optical fiber with metal coating is a glasses fiber, and the surface of the fiber is wrapped with a thin metal coating. In an aspect of the invention, the optical fiber with metal coating can guide the visible and infrared light from the light source to the guide's terminating face more efficiently. By the total reflection that occurred at the surface of optical fiber/metal coating interface (about the transmitted/guided light within the fiber), the metal coating can keep the leakage of the transmitted light within the fiber away, and maintain the transmitted light to stay in the optical fiber. So the purpose to transmit and directing light through the optical fiber more efficiently can achieve by this invention.