Patents by Inventor LI CHIEN
LI CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250105538Abstract: An insertion slot connector and a connector assembly. The insertion slot connector includes an insulating body and multiple conductive terminals. The insulating body includes two side walls, a bottom wall and an insertion slot. The insulating body has a mating surface and a mounting surface provided opposite to each other. The insertion slot runs through the mating surface. Each conductive terminal includes a base, an elastic arm extending from the base toward the mating surface and turns back to extend toward the bottom wall, a contact portion provided at a tail end of the elastic arm and a soldering portion. A distance between the insertion slot and the soldering surface of the soldering portion in the insertion direction is not greater than 0.70 mm. The connector assembly includes a circuit board and at least one insertion slot connector and at least one card edge connector alternately mounted thereon.Type: ApplicationFiled: August 29, 2024Publication date: March 27, 2025Inventors: Chien-Chih Ho, Jian-Wen Zhang, Ping-Han Tsou, Li-Chien Wan
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Patent number: 12245373Abstract: A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.Type: GrantFiled: February 3, 2022Date of Patent: March 4, 2025Assignee: ASUSTEK COMPUTER INC.Inventors: Ping-Han Tsou, Li-Chien Wan
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Patent number: 12235943Abstract: Determining a level of congruence between modality-event characteristics is disclosed. Information can be collected from an event input source via one or more information collection modalities. Modality-event characteristics can be determined from this information. A level of congruence between the modality-event characteristics can be determined to enable initiating a response based on the level of congruence. The level of congruence can be based on satisfying a rule related to congruence between modality-event characteristics, user profile information, etc. The level of congruence can be related to a probability that the several inputs collected for an event, collected by a plurality of modalities, embody characteristics that are associated with the event occurring according to determined notions embodied in the rule and profile. Determining the level of congruence can support assertions that each input, across differing modes of capturing said input, accords with the expected inputs for an event.Type: GrantFiled: June 7, 2022Date of Patent: February 25, 2025Assignee: AT&T Mobility II LLCInventor: Ginger Li Chien
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Publication number: 20240304445Abstract: A photomask structure includes a plurality of first layout patterns, a plurality of second layout patterns, and a ring-shaped layout pattern. The first layout patterns and the second layout patterns are alternately arranged. Each of the first layout patterns has a first end and a second end. Each of the second layout patterns has a third end and a fourth end. The first end is adjacent to the third end. The second end is adjacent to the fourth end. The ring-shaped layout pattern surrounds the first layout patterns and the second layout patterns. The first end is connected to the ring-shaped layout pattern. The second end is not connected to the ring-shaped layout pattern. The third end is not connected to the ring-shaped layout pattern. The fourth end is connected to the ring-shaped layout pattern.Type: ApplicationFiled: December 25, 2023Publication date: September 12, 2024Applicant: Winbond Electronics Corp.Inventors: Kao-Tun Chen, Li-Chien Wang
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Publication number: 20240053190Abstract: A system includes a processor, and a display, a reader, a switch, a scale, a memory device, intake-type buttons and output-type buttons that are connected to the processor. The processor controls the display to display an identification number obtained by using the reader to read an identifier. The switch is operated to enable the processor to operate in an intake mode or an output mode. When operating in the intake (output) mode, the processor controls the display to display a symbol corresponding to one of the intake-type (output-type) buttons that is determined to be pressed, and in response to receipt of weight data from the scale, controls the display to display a value of pre-intake (post-output) weight obtained based on the weight data, and stores the value of pre-intake (post-output) weight in the memory device.Type: ApplicationFiled: August 7, 2023Publication date: February 15, 2024Inventors: Ying-Li LEE, Jiun-Hung LIN, Chun-Hao LU, Yen-Jung LU, Chia-Chen HSU, Chih-Yi LI, Ching-Yu LEE, Chia-Chi CHANG, Ya-Wen KUNG, Li-Chien YANG, Huey-Jeng YANG
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Publication number: 20240044701Abstract: A light sensor structure and the manufacturing method thereof are disclosed. The light sensor structure includes a substrate with a first surface and a second surface opposite to each other. A light sensing element including a light sensing area is disposed on the first surface. A reflection layer is disposed on the second surface. The reflection layer covers a portion of the second surface aligning with the light sensing area.Type: ApplicationFiled: August 16, 2023Publication date: February 8, 2024Inventors: Li-Chien Su, Yen-Wei Liao, Yuan-Ching Hsu
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Publication number: 20230307377Abstract: A self-aligned multiple patterning mark is provided. The mark includes a group of patterns disposed on the substrate and a cover layer. The group of patterns includes a plurality of strip patterns extending in a first direction and arranged parallel to each other, and the ends of two adjacent strip patterns are connected to each other to form an independent ring. The cover layer is disposed on the substrate and covers the group of patterns. The cover layer has an opening extending in a second direction across the first direction, and the cover layer covers two opposite ends of each strip pattern.Type: ApplicationFiled: February 21, 2023Publication date: September 28, 2023Applicant: Winbond Electronics Corp.Inventors: Chiao-Ling Hsu, Li-Chien Wang
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Publication number: 20230138317Abstract: An apparatus for semiconductor processing is provided. The apparatus includes a housing comprising a plurality of shelves configured to receive a plurality of substrates; a shelter plate disposed over an upper side of the housing and configured to reduce heat loss of an upper substrate of the plurality of substrates; and an airflow structure in the housing and configured to control an air circulation in the housing.Type: ApplicationFiled: January 16, 2022Publication date: May 4, 2023Inventors: Li-Chien Tseng, Ming-Shiou Kuo
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Publication number: 20230031184Abstract: A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.Type: ApplicationFiled: February 3, 2022Publication date: February 2, 2023Inventors: Ping-Han TSOU, Li-Chien WAN
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Patent number: 11494475Abstract: The invention provides a safety system for a cleanroom, which comprises a cleanroom garment provided with a plurality of RFID (radio frequency identification) tags, a face recognition device arranged at an entrance of the cleanroom, and a first RFID reader arranged beside at least one machine in the cleanroom, wherein the first RFID reader is used for identifying the RFID tags on the cleanroom garment, and a KVM network power interrupter connected to a display screen of the machine.Type: GrantFiled: April 7, 2020Date of Patent: November 8, 2022Assignee: United Semiconductor (Xiamen) Co., Ltd.Inventors: Chao Wu, Chung-Li Chien, Cheng-Tar Lu, Zi Xin Chen, Sheng Kai Wang, Wen Yi Tan
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Publication number: 20220300594Abstract: Determining a level of congruence between modality-event characteristics is disclosed. Information can be collected from an event input source via one or more information collection modalities. Modality-event characteristics can be determined from this information. A level of congruence between the modality-event characteristics can be determined to enable initiating a response based on the level of congruence. The level of congruence can be based on satisfying a rule related to congruence between modality-event characteristics, user profile information, etc. The level of congruence can be related to a probability that the several inputs collected for an event, collected by a plurality of modalities, embody characteristics that are associated with the event occurring according to determined notions embodied in the rule and profile. Determining the level of congruence can support assertions that each input, across differing modes of capturing said input, accords with the expected inputs for an event.Type: ApplicationFiled: June 7, 2022Publication date: September 22, 2022Inventor: Ginger Li Chien
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Patent number: 11438333Abstract: A mobile device enabled tiered data exchange via a vehicle is disclosed. A mobile device can access profile information related to a tiered-data sharing profile. The tiered-data sharing profile can associate data with a sharing tier designating security, privacy, or authorization constraints on sharing the associated data. A sharing tier can further designate obfuscation of the data as a constraint on sharing the data. The mobile device can enable access to the data subject to the constraints of the tiered-data sharing profile. In an embodiment, tiered data can be shared from the mobile device to an external service device via vehicle device. In another embodiment, tiered data can be shared from the mobile device to a service device of the vehicle.Type: GrantFiled: June 15, 2020Date of Patent: September 6, 2022Assignees: AT&T INIELLECTUAL PROPERTY I, L.P., AT&T MOBILITY II LLCInventors: Yehoshuva Arasavelli, Ginger Li Chien
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Publication number: 20220233649Abstract: The disclosure relates to a dosage forms and combinations of dosage forms useful for effective oral administration of drugs which are otherwise unsuitable for oral administration, owing to acid- and/or protease-mediated degradation. The dosage forms include a self-microemulsifying drug delivery system (SMEDDS) with which the drug is combined and an antacid. When co-administered to a mammal, the dosage form(s) can prevent drug degradation by the strong acid and digestive enzymes normally present in the gastric environment, and can improve water-soluble drug absorption in gastrointestinal (GI) tract. The dosage forms can be used to effectively administer insulin by an oral route, for example, such as in the form of a powder that can be stored for long periods and reconstituted with water or another fluid shortly before administration.Type: ApplicationFiled: April 13, 2022Publication date: July 28, 2022Applicant: InnoPharmax, Inc.Inventors: Yu-Tsai YANG, Jong-Jing WANG, Pei-Jing HSU, Li-Chien CHANG, Wei-Hua HAO, Chang-Shan HSU
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Patent number: 11386190Abstract: Determining a level of congruence between modality-event characteristics is disclosed. Information can be collected from an event input source via one or more information collection modalities. Modality-event characteristics can be determined from this information. A level of congruence between the modality-event characteristics can be determined to enable initiating a response based on the level of congruence. The level of congruence can be based on satisfying a rule related to congruence between modality-event characteristics, user profile information, etc. The level of congruence can be related to a probability that the several inputs collected for an event, collected by a plurality of modalities, embody characteristics that are associated with the event occurring according to determined notions embodied in the rule and profile. Determining the level of congruence can support assertions that each input, across differing modes of capturing said input, accords with the expected inputs for an event.Type: GrantFiled: June 27, 2019Date of Patent: July 12, 2022Assignee: AT&T MOBILITY II LLCInventor: Ginger Li Chien
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Patent number: 11331376Abstract: The disclosure relates to a dosage forms and combinations of dosage forms useful for effective oral administration of drugs which are otherwise unsuitable for oral administration, owing to acid- and/or protease-mediated degradation. The dosage forms include a self-microemulsifying drug delivery system (SMEDDS) with which the drug is combined and an antacid. When co-administered to a mammal, the dosage form(s) can prevent drug degradation by the strong acid and digestive enzymes normally present in the gastric environment, and can improve water-soluble drug absorption in gastrointestinal (GI) tract. The dosage forms can be used to effectively administer insulin by an oral route, for example, such as in the form of a powder that can be stored for long periods and reconstituted with water or another fluid shortly before administration.Type: GrantFiled: November 4, 2015Date of Patent: May 17, 2022Assignee: INNOPHARMAX, INC.Inventors: Yu-Tsai Yang, Jong-Jing Wang, Pei-Jing Hsu, Li-Chien Chang, Wei-Hua Hao, Chang-Shan Hsu
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Publication number: 20220128400Abstract: A light sensor structure and the manufacturing method thereof are disclosed. The light sensor structure includes a substrate with a first surface and a second surface opposite to each other. A light sensing element including a light sensing area is disposed on the first surface. A reflection layer is disposed on the second surface. The reflection layer covers a portion of the second surface aligning with the light sensing area.Type: ApplicationFiled: August 2, 2021Publication date: April 28, 2022Inventors: LI-CHIEN SU, YEN-WEI LIAO, YUAN-CHING HSU
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Patent number: 11289839Abstract: A memory slot adapted to dispose on a circuit board is provided. The memory slot includes a slot body and a plurality of pins. The slot body includes N connecting parts for configuring to M memory cards. The plurality of pins are disposed in the slot body for electrically connecting the M memory cards to the circuit board. Each pin includes O branches extending to the connecting parts respectively for electrically connecting corresponding golden fingers of the memory cards. Where the N, M and O are greater than or equal to 2. The disclosure further provides a main board with the memory slot.Type: GrantFiled: February 19, 2020Date of Patent: March 29, 2022Assignee: ASUSTEK COMPUTER INC.Inventors: Ping-Han Tsou, Li-Chien Wan
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Patent number: 11284505Abstract: A printed circuit board comprising a main body, a first insulation layer, and an anti-electromagnetic interference (EMI) coating is provided. The first insulation layer covers the main body and comprises a predetermined area. The anti-EMI coating covers the predetermined area, and comprises wave-absorption powders and an adhesive material. A motherboard with the printed circuit board is also provided.Type: GrantFiled: May 18, 2020Date of Patent: March 22, 2022Assignee: ASUSTEK COMPUTER INC.Inventors: Ping-Han Tsou, Li-Chien Wan
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Patent number: 11191149Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.Type: GrantFiled: January 8, 2020Date of Patent: November 30, 2021Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Yuan-Li Chien, Yen-Yun Chang
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Patent number: 11152270Abstract: A monitoring structure for a critical dimension of a lithography process including a dummy pattern layer and a patterned photoresist layer is provided. The dummy pattern layer includes a dummy pattern. The patterned photoresist layer includes at least one monitoring mark located above the dummy pattern. The monitoring mark includes a first portion and a second portion that intersect each other. The first portion extends in a first direction, the second portion extends in a second direction, and the first direction intersects the second direction.Type: GrantFiled: December 1, 2019Date of Patent: October 19, 2021Assignee: Winbond Electronics Corp.Inventors: Li-Chien Wang, Cheng-Hsiang Liu, Meng-Hsien Tsai