Patents by Inventor Li-Chien Wan

Li-Chien Wan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230031184
    Abstract: A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.
    Type: Application
    Filed: February 3, 2022
    Publication date: February 2, 2023
    Inventors: Ping-Han TSOU, Li-Chien WAN
  • Patent number: 11289839
    Abstract: A memory slot adapted to dispose on a circuit board is provided. The memory slot includes a slot body and a plurality of pins. The slot body includes N connecting parts for configuring to M memory cards. The plurality of pins are disposed in the slot body for electrically connecting the M memory cards to the circuit board. Each pin includes O branches extending to the connecting parts respectively for electrically connecting corresponding golden fingers of the memory cards. Where the N, M and O are greater than or equal to 2. The disclosure further provides a main board with the memory slot.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: March 29, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ping-Han Tsou, Li-Chien Wan
  • Patent number: 11284505
    Abstract: A printed circuit board comprising a main body, a first insulation layer, and an anti-electromagnetic interference (EMI) coating is provided. The first insulation layer covers the main body and comprises a predetermined area. The anti-EMI coating covers the predetermined area, and comprises wave-absorption powders and an adhesive material. A motherboard with the printed circuit board is also provided.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: March 22, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ping-Han Tsou, Li-Chien Wan
  • Publication number: 20200375021
    Abstract: A printed circuit board comprising a main body, a first insulation layer, and an anti-electromagnetic interference (EMI) coating is provided. The first insulation layer covers the main body and comprises a predetermined area. The anti-EMI coating covers the predetermined area, and comprises wave-absorption powders and an adhesive material. A motherboard with the printed circuit board is also provided.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 26, 2020
    Inventors: Ping-Han TSOU, Li-Chien WAN
  • Publication number: 20200274274
    Abstract: A memory slot adapted to dispose on a circuit board is provided. The memory slot includes a slot body and a plurality of pins. The slot body includes N connecting parts for configuring to M memory cards. The plurality of pins are disposed in the slot body for electrically connecting the M memory cards to the circuit board. Each pin includes O branches extending to the connecting parts respectively for electrically connecting corresponding golden fingers of the memory cards. Where the N, M and O are greater than or equal to 2. The disclosure further provides a main board with the memory slot.
    Type: Application
    Filed: February 19, 2020
    Publication date: August 27, 2020
    Inventors: Ping-Han TSOU, Li-Chien WAN
  • Patent number: 10740279
    Abstract: A motherboard includes a multilayer printed circuit board (PCB), a central processing unit (CPU) slot, at least one first memory slot, at least one second memory slot, a plurality of first traces, and a plurality of second traces. The CPU slot, the first memory slot, and the second memory slot are disposed on the first wiring layer of the multilayer PCB, and the second memory slot is disposed between the first memory slot and the CPU slot. The first traces are disposed on the first wiring layer of the multilayer PCB. The CPU slot is electrically connected to the first memory slot by the first traces. The second traces are disposed on the second wiring layer of the multilayer PCB which is different from the first wiring layer, and the CPU slot is electrically connected with the second memory slot by the second traces.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: August 11, 2020
    Assignee: Asustek Computer Inc.
    Inventor: Li-Chien Wan
  • Patent number: 10729003
    Abstract: An anti-electromagnetic interference circuit board includes a circuit board and a magnetic conductor. The circuit board has a plurality of vias, and the magnetic conductor is covered on the circuit board to cover some of the vias. The magnetic conductor includes a plate, a carrier, a sprayed magnetic conductor, and a wave absorbing magnetic conductor.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: July 28, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ping-Han Tsou, Li-Chien Wan
  • Publication number: 20200015350
    Abstract: An anti-electromagnetic interference circuit board includes a circuit board and a magnetic conductor. The circuit board has a plurality of vias, and the magnetic conductor is covered on the circuit board to cover some of the vias. The magnetic conductor includes a plate, a carrier, a sprayed magnetic conductor, and a wave absorbing magnetic conductor.
    Type: Application
    Filed: June 18, 2019
    Publication date: January 9, 2020
    Inventors: Ping-Han TSOU, Li-Chien WAN
  • Publication number: 20190042531
    Abstract: A motherboard includes a multilayer printed circuit board (PCB), a central processing unit (CPU) slot, at least one first memory slot, at least one second memory slot, a plurality of first traces, and a plurality of second traces. The CPU slot, the first memory slot, and the second memory slot are disposed on the first wiring layer of the multilayer PCB, and the second memory slot is disposed between the first memory slot and the CPU slot. The first traces are disposed on the first wiring layer of the multilayer PCB. The CPU slot is electrically connected to the first memory slot by the first traces. The second traces are disposed on the second wiring layer of the multilayer PCB which is different from the first wiring layer, and the CPU slot is electrically connected with the second memory slot by the second traces.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 7, 2019
    Inventor: Li-Chien WAN
  • Publication number: 20160210250
    Abstract: A motherboard with dual memory slot is disclosed. The motherboard includes multiple first memory slots, multiple second memory slots, a storage unit, and a CPU. The first and second memory slots are used for connecting with memory modules of different specifications. A storage unit stores BIOS which identifies the specification of the memory module in booting, and the identification result is provided to the CPU. Consequently, the memory controller in the CPU controls the reading and writing to the memory module according the determining result of the BIOS. As a result, a single motherboard supports memory modules of different specifications, and the flexibility of using the memory modules is improved.
    Type: Application
    Filed: January 8, 2016
    Publication date: July 21, 2016
    Inventors: Li-Chien Wan, Hsin-Ting Chen, Jian-Tzuo Chen