Patents by Inventor Li-Chih Yu
Li-Chih Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128324Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.Type: ApplicationFiled: November 21, 2022Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Kuo-Chih Lai, Shih-Min Chou, Nien-Ting Ho, Wei-Ming Hsiao, Li-Han Chen, Szu-Yao Yu, Chung-Yi Chiu
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Patent number: 11956994Abstract: The present disclosure is generally related to 3D imaging capable OLED displays. A light field display comprises an array of 3D light field pixels, each of which comprises an array of corrugated OLED pixels, a metasurface layer disposed adjacent to the array of 3D light field pixels, and a plurality of median layers disposed between the metasurface layer and the corrugated OLED pixels. Each of the corrugated OLED pixels comprises primary or non-primary color subpixels, and produces a different view of an image through the median layers to the metasurface to form a 3D image. The corrugated OLED pixels combined with a cavity effect reduce a divergence of emitted light to enable effective beam direction manipulation by the metasurface. The metasurface having a higher refractive index and a smaller filling factor enables the deflection and direction of the emitted light from the corrugated OLED pixels to be well controlled.Type: GrantFiled: August 10, 2021Date of Patent: April 9, 2024Assignee: Applied Materials, Inc.Inventors: Chung-Chih Wu, Hoang Yan Lin, Guo-Dong Su, Zih-Rou Cyue, Li-Yu Yu, Wei-Kai Lee, Guan-Yu Chen, Chung-Chia Chen, Wan-Yu Lin, Gang Yu, Byung-Sung Kwak, Robert Jan Visser, Chi-Jui Chang
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Patent number: 9955569Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.Type: GrantFiled: November 29, 2016Date of Patent: April 24, 2018Assignee: Elite Material Co., Ltd.Inventors: Ya-Wen Kuo, Li-Chih Yu, Ching-Hsin Ho
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Patent number: 9650512Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.Type: GrantFiled: August 10, 2013Date of Patent: May 16, 2017Assignee: Elite Electronic Material (Kunshan) Co., LtdInventors: Rong-Tao Wang, Li-Chih Yu, Yu-Te Lin, Yi-Jen Chen, Wenjun Tian, Ziqian Ma, Wenfeng Lu
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Publication number: 20170079134Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.Type: ApplicationFiled: November 29, 2016Publication date: March 16, 2017Inventors: Ya-Wen KUO, Li-Chih YU, Ching-Hsin HO
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Patent number: 9545018Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.Type: GrantFiled: December 2, 2014Date of Patent: January 10, 2017Assignee: ELITE MATERIAL CO., LTD.Inventors: Ya-Wen Kuo, Li-Chih Yu, Ching-Hsin Ho
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Patent number: 9422412Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.Type: GrantFiled: September 22, 2011Date of Patent: August 23, 2016Assignee: ELITE MATERIAL CO., LTD.Inventors: Li-Chih Yu, Tse-An Lee
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Patent number: 9394438Abstract: A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.Type: GrantFiled: February 5, 2013Date of Patent: July 19, 2016Assignee: ELITE MATERIAL CO., LTD.Inventors: Li-Chih Yu, Tse-An Lee
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Patent number: 9392683Abstract: A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55? in single-ended signaling and between 90 and 110? in differential signaling.Type: GrantFiled: November 26, 2014Date of Patent: July 12, 2016Assignee: ELITE MATERIAL CO., LTD.Inventors: Ming-Chuan Chang, Li-Chih Yu, Yu-Te Lin
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Publication number: 20160165714Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a warpage characteristic lower than that of the insulation layers.Type: ApplicationFiled: January 22, 2015Publication date: June 9, 2016Inventors: Ocean CHEN, Li-Chih YU, Xiangnan LI, Xingfa CHEN
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Publication number: 20160128180Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.Type: ApplicationFiled: December 2, 2014Publication date: May 5, 2016Inventors: Ya-Wen KUO, Li-Chih YU, Ching-Hsin HO
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Publication number: 20160120018Abstract: A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55 ? in single-ended signaling and between 90 and 110 ? in differential signaling.Type: ApplicationFiled: November 26, 2014Publication date: April 28, 2016Inventors: Ming-Chuan CHANG, Li-Chih YU, Yu-Te LIN
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Patent number: 9288904Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.Type: GrantFiled: January 11, 2013Date of Patent: March 15, 2016Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTDInventors: Rong-Tao Wang, Li-Ming Chou, Li-Chih Yu, Yu-Te Lin
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Patent number: 9279051Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.Type: GrantFiled: November 19, 2012Date of Patent: March 8, 2016Assignee: ELITE MATERIAL CO., LTD.Inventors: Li-Chih Yu, Tse-An Lee
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Patent number: 9238733Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.Type: GrantFiled: November 16, 2012Date of Patent: January 19, 2016Assignee: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.Inventors: Chang-Yuan Li, Li-Ming Chou, Li-Chih Yu, Tse-An Lee
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Patent number: 9185801Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.Type: GrantFiled: March 15, 2013Date of Patent: November 10, 2015Assignee: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTDInventors: Chang-Yuan Li, Li-Chih Yu, Hong-Xia Peng
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Publication number: 20140322541Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.Type: ApplicationFiled: August 10, 2013Publication date: October 30, 2014Applicant: Elite Electronic Material (Kunshan) Co., LtdInventors: RONG-TAO WANG, LI-CHIH YU, YU-TE LIN, YI-JEN CHEN, WENJUN TIAN, ZIQIAN MA, WENFENG LU
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Publication number: 20140178696Abstract: A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.Type: ApplicationFiled: February 5, 2013Publication date: June 26, 2014Applicant: ELITE MATERIAL CO., LTD.Inventors: LI-CHIH YU, TSE-AN LEE
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Publication number: 20130316155Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.Type: ApplicationFiled: November 16, 2012Publication date: November 28, 2013Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTDInventors: CHANG-YUAN LI, LI-MING CHOU, LI-CHIH YU, TSE-AN LEE
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Publication number: 20130075138Abstract: The halogen-free resin composition comprises (A)100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.Type: ApplicationFiled: September 22, 2011Publication date: March 28, 2013Inventors: Li-Chih YU, Tse-An Lee