Abstract: A semiconductor device includes a semiconductor substrate, a source/drain region, a source/drain contact and a conductive via and a first polymer layer. The source/drain region is in the semiconductor substrate. The source/drain contact is over the source/drain region. The conductive via is over the source/drain contact. From a top view, the conductive via has two opposite long sides and two opposite short sides connecting the long sides, and the short sides are shorter than the long sides and more curved than the long sides.

Abstract: The present invention discloses a force feedback hand training method including: providing a training game content and adjusting the training game content based on predetermined parameters; displaying the training game content on a display; determining whether an input button position of at least one input signal from a hand training device matches a predetermined input button position; and storing a determination result in a storage module.

Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: A semiconductor device and method of manufacture are provided. In some embodiments isolation regions are formed by modifying a dielectric material of a dielectric layer such that a first portion of the dielectric layer is more readily removed by an etching process than a second portion of the dielectric layer. The modifying of the dielectric material facilitates subsequent processing steps that allow for the tuning of a profile of the isolation regions to a desired geometry based on the different material properties of the modified dielectric material.

Abstract: Disclosed is a pressure-sensitive adhesive matrix patch device for treatment or prevention of fungal toenails or fingernails or foot infections comprising an antifungal agent or two or more antifungals in combination and adhesively secured to a dorsal site of an infected palm or foot, rather than an area of infection and surrounding skin. A method for the transdermal treatment or prevention of fungal toenails or fingernails or foot infections with an antifungal agent is also disclosed, the method comprising adhesively securing to a dorsal site of an infected palm or foot a pressure-sensitive adhesive matrix patch device for a time sufficient to deliver an effective amount of the antifungal agent to an area of infection.

Abstract: A method for converting a computerized briefing file to a PC-less briefing file is disclosed and comprises the steps of: presenting the computerized briefing file via a briefing software, wherein the computerized briefing file has a plurality of pages of briefing data; capturing the plurality of frames of the presented page of briefing data while presenting each page of briefing data, wherein if a difference block is existed between the last frame and the next frame, the difference block being stored in the PC-less file, otherwise, to presenting the next frame; judging whether the pagination of the presented frame is changed or not, if not, continuously capturing, comparing and storing the present page of briefing data, otherwise, capturing, comparing and storing the next page of briefing data; and such steps are not stopped until the last page of briefing data has being done.

Abstract: Disclosed is a pressure-sensitive adhesive matrix patch device for treatment or prevention of fungal toenails or fingernails or foot infections comprising an antifungal agent or two or more antifungals in combination and adhesively secured to a dorsal site of an infected palm or foot, rather than an area of infection and surrounding skin. A method for the transdermal treatment or prevention of fungal toenails or fingernails or foot infections with an antifungal agent is also disclosed, the method comprising adhesively securing to a dorsal site of an infected palm or foot a pressure-sensitive adhesive matrix patch device for a time sufficient to deliver an effective amount of the antifungal agent to an area of infection.

Abstract: A method for converting a computerized briefing file to a PC-less briefing file is disclosed and comprises the steps of: presenting the computerized briefing file via a briefing software, wherein the computerized briefing file has a plurality of pages of briefing data; capturing the plurality of frames of the presented page of briefing data while presenting each page of briefing data, wherein if a difference block is existed between the last frame and the next frame, the difference block being stored in the PC-less file, otherwise, presenting the next frame; judging whether the pagination of the presented frame is changed or not, if not, continuously capturing, comparing and storing the present page of briefing data, otherwise, capturing, comparing and storing the next page of briefing data; and such steps are not stopped until the last page of briefing data has being done.

Abstract: An enteric sustained-release coated core includes a drug-containing core and a coating film. The coating film includes 20%˜80% by weight of a hydrophobic polymer and 10%˜70% by weight of an enterosoluble material. The dissolution rate of the medical component in the drug-containing core is approximately less than 10% in hydrochloric acid solution of pH 1˜3 after 2 hours. The dissolution of the medical component in the drug-containing core sustains more than 5 hours in phosphate buffer solution of pH 5˜8.