Patents by Inventor Li-Ching Hong

Li-Ching Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS package structure
    Patent number: 7786560
    Abstract: A package structure including a chip, a lid, a substrate, a plurality of wires, an encapsulant, and a moisture resistive layer is provided. The chip has an active area where at least one MEMS device is disposed. The lid is covered on the chip, and the substrate is used to carry the chip and the lid. The plurality of wires is electrically connected between the substrate and the chip. The encapsulant is sealed around the lid and exposes an upper surface of the lid. The moisture resistive layer is covered on the encapsulant to enhance the airtightness and the moisture resistance of the encapsulant.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: August 31, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Li-Ching Hong
  • MEMES PACKAGE STRUCTURE
    Publication number: 20090115007
    Abstract: A package structure including a chip, a lid, a substrate, a plurality of wires, an encapsulant, and a moisture resistive layer is provided. The chip has an active area where at least one MEMS device is disposed. The lid is covered on the chip, and the substrate is used to carry the chip and the lid. The plurality of wires is electrically connected between the substrate and the chip. The encapsulant is sealed around the lid and exposes an upper surface of the lid. The moisture resistive layer is covered on the encapsulant to enhance the airtightness and the moisture resistance of the encapsulant.
    Type: Application
    Filed: September 19, 2008
    Publication date: May 7, 2009
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Li-Ching Hong